Data Sheet. HMC8205BCHIPS. TYPICAL PERFORMANCE CHARACTERISTICS. S11. S21. S22. d (. S 20. URN L. AND RE. N AND RE. AI G. –10. –15. 0.1. 0.2. 0.3. 0.4. 0.5
Data SheetHMC8205BCHIPSTYPICAL PERFORMANCE CHARACTERISTICS3535S11S2130S2130S11S22S222525B)B)d ((dS20S 20SSOO1515URN LURN LT1010T55AND REN AND RE00INAI G–5GA5–1010–1515 12 1 01234567 009 00.10.20.30.40.50.60.70.80.91.0FREQUENCY (GHz)FREQUENCY (GHz) 13790- 13790- Figure 9. Gain and Return Loss vs. Frequency Figure 12. Gain and Return Loss vs. Frequency, 10 MHz to 1000 MHz 353530302525B)B)ddN (N (AIAIG20G2028V1540V1545V 50V+85°C55V+25°C –55°C10100123456 010 0123456 012 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 10. Gain vs. Frequency at Various Supply Voltages Figure 13. Gain vs. Frequency at Various Temperatures 035+85°C–2+25°C –55°C30B) d–4( S S O25–6B) d N (URN L TAI–8G20RE UT–10INP15–121300mA 900mA 500mA–14 1 10 1 0123456 0 0123456 013 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 11. Input Return Loss vs. Frequency at Varoius Temperatures Figure 14. Gain vs. Frequency at Various Quiescent Supply Currents (IDDx) Rev. A | Page 7 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE