Data SheetHMC8205BCHIPS50504848464644444242Bm)Bm)dd(40(40UTUTOOP38P3836363434+85°C+85°C32+25°C32+25°C–55°C–55°C303001234567 020 01234567 022 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 21. POUT vs. Frequency at Various Temperatures, PIN = 24 dBm Figure 24. POUT vs. Frequency at Various Temperatures, PIN = 28 dBm 50504848464644444242Bm)Bm)(d40(d40UTUTOOP38P38363628V3428V40V3440V45V45V3250V3250V55V55V303001234567 021 01234567 023 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 22. POUT vs. Frequency at Various Voltages, PIN = 24 dBm Figure 25. POUT vs. Frequency at Various Voltages, PIN = 28 dBm 50504848464644444242Bm)Bm)(d40(d40UTUTOOP38P38363634341300mA1300mA32900mA32900mA500mA500mA303001234567 024 01234567 025 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 23. POUT vs. Frequency at Various Quiescent Currents (IDD1 + IDD2), Figure 26. POUT vs. Frequency at Various Quiescent Currents (IDD1 + IDD2), PIN = 24 dBm PIN = 28 dBm Rev. A | Page 9 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE