Datasheet STGAP3S6I (STMicroelectronics) - 5
| Hersteller | STMicroelectronics |
| Beschreibung | Galvanically Isolated 6/10 A Single Gate Drivers With Protection Features |
| Seiten / Seite | 32 / 5 — STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS. Device ratings. 3.3. … |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS. Device ratings. 3.3. Recommended operating conditions
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STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS Device ratings 3.3 Recommended operating conditions Table 4. Recommended operating conditions Symbol Parameter Min. Max. Unit
VDD Logic supply voltage vs. GND 3.1 5.5 V VLOGIC Logic pins (IN+, IN-, RST) voltage vs. GND 0 5.5 V VH Positive supply voltage (VH vs. GNDISO) 5 32 V VL Negative supply voltage (VL vs. GNDISO) -10 0 V VHL Differential supply voltage (VH vs. VL) - 32 V VDESATth Threshold voltage of DESAT protection vs. GND - VH - 2 V FSW Maximum switching frequency (1) - 1 MHz TJ Operating junction temperature -40 125 °C Tamb Ambient temperature -40 125 °C 1. Actual limit depends on power dissipation and TJ.
DS14758
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Rev 1 page 5/32
Document Outline STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS @NA Cover image @NA Device summary Features Applications Description 1 Block diagram 2 Pin description and connection diagram 3 Device ratings 3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Recommended operating conditions 4 Electrical characteristics 5 Isolation 6 Functional description 6.1 Power supplies and UVLO 6.2 Power-up, power-down, and “safe state” 6.3 Control inputs 6.3.1 Anti cross conduction interlocking 6.4 Miller clamp function 6.4.1 Miller clamp driver 6.5 Desaturation protection 6.5.1 Adjustable soft turn-off function 6.6 Watchdog 6.7 Thermal shutdown protection 7 Typical application diagram 8 PCB layout 8.1 Layout guidelines and considerations 8.2 Layout example 9 Unused functions 10 Testing and characterization information 11 Package information 11.1 SO-16W package information 11.2 SO-16W suggested land pattern 12 Ordering information Revision history Contents List of tables List of figures
STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS Device ratings 3.3 Recommended operating conditions Table 4. Recommended operating conditions Symbol Parameter Min. Max. Unit
VDD Logic supply voltage vs. GND 3.1 5.5 V VLOGIC Logic pins (IN+, IN-, RST) voltage vs. GND 0 5.5 V VH Positive supply voltage (VH vs. GNDISO) 5 32 V VL Negative supply voltage (VL vs. GNDISO) -10 0 V VHL Differential supply voltage (VH vs. VL) - 32 V VDESATth Threshold voltage of DESAT protection vs. GND - VH - 2 V FSW Maximum switching frequency (1) - 1 MHz TJ Operating junction temperature -40 125 °C Tamb Ambient temperature -40 125 °C 1. Actual limit depends on power dissipation and TJ.
DS14758
-
Rev 1 page 5/32
Document Outline STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS @NA Cover image @NA Device summary Features Applications Description 1 Block diagram 2 Pin description and connection diagram 3 Device ratings 3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Recommended operating conditions 4 Electrical characteristics 5 Isolation 6 Functional description 6.1 Power supplies and UVLO 6.2 Power-up, power-down, and “safe state” 6.3 Control inputs 6.3.1 Anti cross conduction interlocking 6.4 Miller clamp function 6.4.1 Miller clamp driver 6.5 Desaturation protection 6.5.1 Adjustable soft turn-off function 6.6 Watchdog 6.7 Thermal shutdown protection 7 Typical application diagram 8 PCB layout 8.1 Layout guidelines and considerations 8.2 Layout example 9 Unused functions 10 Testing and characterization information 11 Package information 11.1 SO-16W package information 11.2 SO-16W suggested land pattern 12 Ordering information Revision history Contents List of tables List of figures