Datasheet STGAP3S6I, STGAP3S6S STGAP3SXI, STGAP3SXS (STMicroelectronics) - 4
| Hersteller | STMicroelectronics |
| Beschreibung | Galvanically Isolated 6/10 A Single Gate Drivers With Protection Features |
| Seiten / Seite | 32 / 4 — STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS. Device ratings. 3.1. Absolute … |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS. Device ratings. 3.1. Absolute maximum ratings. Table 2. Absolute maximum ratings
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STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS Device ratings 3 Device ratings 3.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Parameter Min. Max. Unit
VDD Logic supply voltage vs. GND -0.3 6 V VLOGIC Logic pins voltage (IN+, IN-, RST) vs. GND -0.3 6 V VH Positive supply voltage VH vs. GNDISO -0.3 36 V VL Negative supply voltage VL vs. GNDISO -15 0.3 V VHL Differential supply voltage VH vs. VL -0.3 36 V VOUT Voltage on gate driver outputs (GOUT, CLAMP, SOFTOFF) vs. VL VL - 0.3 VH + 0.3 V VCLAMPdrv Voltage on CLAMPdrv output vs. VL VL - 0.3 min(+20, VH + 0.3) V VDESAT Voltage on DESAT vs. GNDISO -0.3 VH + 0.3 V VDIAG Open drain output voltage vs. GND -0.3 6.0 V VRDY Open drain output voltage vs. GND -0.3 6.0 V TJ Junction temperature -40 150 °C Tstg Storage temperature -55 150 °C Tamb Ambient temperature -40 125 °C ESD HBM (human body model) 2 kV
3.2 Thermal data Table 3. Thermal data Symbol Parameter Package Value Unit
Rth(JA) Thermal resistance junction-to-ambient SO-16W 74 °C/W
DS14758
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Rev 1 page 4/32
Document Outline STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS @NA Cover image @NA Device summary Features Applications Description 1 Block diagram 2 Pin description and connection diagram 3 Device ratings 3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Recommended operating conditions 4 Electrical characteristics 5 Isolation 6 Functional description 6.1 Power supplies and UVLO 6.2 Power-up, power-down, and “safe state” 6.3 Control inputs 6.3.1 Anti cross conduction interlocking 6.4 Miller clamp function 6.4.1 Miller clamp driver 6.5 Desaturation protection 6.5.1 Adjustable soft turn-off function 6.6 Watchdog 6.7 Thermal shutdown protection 7 Typical application diagram 8 PCB layout 8.1 Layout guidelines and considerations 8.2 Layout example 9 Unused functions 10 Testing and characterization information 11 Package information 11.1 SO-16W package information 11.2 SO-16W suggested land pattern 12 Ordering information Revision history Contents List of tables List of figures
VDD Logic supply voltage vs. GND -0.3 6 V VLOGIC Logic pins voltage (IN+, IN-, RST) vs. GND -0.3 6 V VH Positive supply voltage VH vs. GNDISO -0.3 36 V VL Negative supply voltage VL vs. GNDISO -15 0.3 V VHL Differential supply voltage VH vs. VL -0.3 36 V VOUT Voltage on gate driver outputs (GOUT, CLAMP, SOFTOFF) vs. VL VL - 0.3 VH + 0.3 V VCLAMPdrv Voltage on CLAMPdrv output vs. VL VL - 0.3 min(+20, VH + 0.3) V VDESAT Voltage on DESAT vs. GNDISO -0.3 VH + 0.3 V VDIAG Open drain output voltage vs. GND -0.3 6.0 V VRDY Open drain output voltage vs. GND -0.3 6.0 V TJ Junction temperature -40 150 °C Tstg Storage temperature -55 150 °C Tamb Ambient temperature -40 125 °C ESD HBM (human body model) 2 kV
3.2 Thermal data Table 3. Thermal data Symbol Parameter Package Value Unit
Rth(JA) Thermal resistance junction-to-ambient SO-16W 74 °C/W
DS14758
-
Rev 1 page 4/32
Document Outline STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS @NA Cover image @NA Device summary Features Applications Description 1 Block diagram 2 Pin description and connection diagram 3 Device ratings 3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Recommended operating conditions 4 Electrical characteristics 5 Isolation 6 Functional description 6.1 Power supplies and UVLO 6.2 Power-up, power-down, and “safe state” 6.3 Control inputs 6.3.1 Anti cross conduction interlocking 6.4 Miller clamp function 6.4.1 Miller clamp driver 6.5 Desaturation protection 6.5.1 Adjustable soft turn-off function 6.6 Watchdog 6.7 Thermal shutdown protection 7 Typical application diagram 8 PCB layout 8.1 Layout guidelines and considerations 8.2 Layout example 9 Unused functions 10 Testing and characterization information 11 Package information 11.1 SO-16W package information 11.2 SO-16W suggested land pattern 12 Ordering information Revision history Contents List of tables List of figures