Datasheet IRFP140 (Vishay) - 10

HerstellerVishay
BeschreibungPower MOSFET
Seiten / Seite11 / 10 — Package Information. VERSION 3: FACILITY CODE = N. MILLIMETERS. DIM. MIN. …
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Package Information. VERSION 3: FACILITY CODE = N. MILLIMETERS. DIM. MIN. MAX. Notes

Package Information VERSION 3: FACILITY CODE = N MILLIMETERS DIM MIN MAX Notes

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Package Information
www.vishay.com Vishay Siliconix
VERSION 3: FACILITY CODE = N
A A B E P1 D2 P R/2 N A2 Q S M R DB D1 D D M K L1 C L C b4 E1 b2 A1 b e 0.01 M D B M 0.10 M C A M b1, b3, b5 Base metal c c1 b, b2, b4 Plating
MILLIMETERS MILLIMETERS DIM. MIN. MAX. DIM. MIN. MAX.
A 4.65 5.31 D2 0.51 1.35 A1 2.21 2.59 E 15.29 15.87 A2 1.17 1.37 E1 13.46 - b 0.99 1.40 e 5.46 BSC b1 0.99 1.35 k 0.254 b2 1.65 2.39 L 14.20 16.10 b3 1.65 2.34 L1 3.71 4.29 b4 2.59 3.43 N 7.62 BSC b5 2.59 3.38 P 3.56 3.66 c 0.38 0.89 P1 - 7.39 c1 0.38 0.84 Q 5.31 5.69 D 19.71 20.70 R 4.52 5.49 D1 13.08 - S 5.51 BSC ECN: E22-0452-Rev. G, 31-Oct-2022 DWG: 5971
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994 (2) Contour of slot optional (3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Thermal pad contour optional with dimensions D1 and E1 (5) Lead finish uncontrolled in L1 (6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154") Revision: 31-Oct-2022
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Document Number: 91360 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000