Datasheet STM32WB5MMG (STMicroelectronics) - 3
| Hersteller | STMicroelectronics |
| Beschreibung | Bluetooth Low Energy 5.0 and 802.15.4 module |
| Seiten / Seite | 31 / 3 — STM32WB5MMG. Description. Module overview. Figure 1. STM32WB5MMG module … |
| Dateiformat / Größe | PDF / 3.7 Mb |
| Dokumentensprache | Englisch |
STM32WB5MMG. Description. Module overview. Figure 1. STM32WB5MMG module block diagram. STM32WB55VGY. DS13252. Rev 1. page 3/31
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STM32WB5MMG Description 2 Description
The STM32WB5MMG is an ultra-low-power and small form factor certified 2.4GHz wireless module. It supports Bluetooth® Low Energy 5.0, Zigbee® 3.0, OpenThread, dynamic and static concurrent modes, and 802.15.4 proprietary protocols. Based on STMicroelectronics STM32WB55VGY wireless microcontroller, the STM32WB5MMG provides best-in-class RF performance thanks to its good receiver sensitivity and a high output power signal. Its low-power features enable extended battery life time, small coin-cell batteries or energy harvesting. The STM32WB5MMG requires no RF expertise and is the best way to speed-up any development and to reduce associated costs. The module is completely protocol stack royalty-free.
Module overview
The module is an SiP-LGA86 package (system in package land grid array) that integrates the proven STM32WB55VGY MCU with several external components. The package includes: • LSE crystal • HSE crystal • Passive components for SMPS • Antenna matching and antenna • IPD for RF matching and harmonics rejection
Figure 1. STM32WB5MMG module block diagram
Communication interface
STM32WB55VGY
Antenna 1MB Flash matching 256KB RAM
DS13252
-
Rev 1 page 3/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures
The STM32WB5MMG is an ultra-low-power and small form factor certified 2.4GHz wireless module. It supports Bluetooth® Low Energy 5.0, Zigbee® 3.0, OpenThread, dynamic and static concurrent modes, and 802.15.4 proprietary protocols. Based on STMicroelectronics STM32WB55VGY wireless microcontroller, the STM32WB5MMG provides best-in-class RF performance thanks to its good receiver sensitivity and a high output power signal. Its low-power features enable extended battery life time, small coin-cell batteries or energy harvesting. The STM32WB5MMG requires no RF expertise and is the best way to speed-up any development and to reduce associated costs. The module is completely protocol stack royalty-free.
Module overview
The module is an SiP-LGA86 package (system in package land grid array) that integrates the proven STM32WB55VGY MCU with several external components. The package includes: • LSE crystal • HSE crystal • Passive components for SMPS • Antenna matching and antenna • IPD for RF matching and harmonics rejection
Figure 1. STM32WB5MMG module block diagram
Communication interface
STM32WB55VGY
Antenna 1MB Flash matching 256KB RAM
DS13252
-
Rev 1 page 3/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures