STM32WB5MMG Datasheet Bluetooth® Low Energy 5.0 and 802.15.4 module Features • Integrated chip antenna • Bluetooth® Low Energy 5.0, Zigbee® 3.0, OpenThread certified • Dynamic and static concurrent modes • IEEE 802.15.4-2011 MAC PHY • Supports 2 Mbits/s • TX output power up to +6 dBm These pictures are not contractual • RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4) • Range: up to 75 meters • Dedicated Arm® Cortex®-M0+ for radio and security tasks • Dedicated Arm® Cortex®-M4 CPU with FPU and ART (adaptative real-time accelerator) up to 64 MHz speed • 1-Mbyte Flash memory, 256-Kbyte SRAM • Fully integrated BOM, including 32 MHz radio and 32 KHz RTC crystals • Integrated SMPS • Ultra-low-power modes for battery longevity • 68 GPIOs • Integrated IPD for best-in-class and reliable antenna matching • 1.8 V to 3.6 V VDD range • -40 °C to 85 °C temperature range Product status link • Built-in security features such as: secure firmware installation (SFI) for radio STM32WB5MMG stack, customer key storage/key management services, PKA, AES 256-bit, TRNG, PCROP, CRC, 96-bit UID, possibility to derive 802.15.4 and Bluetooth® Product summary Low Energy 48-bit UEI • Certifications: CE, FCC, IC, JRF, SRRC, RoHS, REACH, GOST, KC, NCC Order code STM32WB5MMG • Two layers PCB compatible (using external raw pins only) Temperature -40 °C to 85 °C rangePackage LGA 86L 10x10 ApplicationPackage 7.3 x 11 x 1.342 x • Lighting and home automation dimensions ( mm) 0.435 pitch • Wireless audio devices Packaging Tape and reel • Wellness, healthcare, personal trackers • Gaming and toys • Smart locks • Beacons and accessories • Industrial DS13252 - Rev 1 - November 2020 www.st.com For further information contact your local STMicroelectronics sales office. Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures