Datasheet MIC920 (Microchip) - 4
Hersteller | Microchip |
Beschreibung | 80 MHz Low-Power SC70 Op Amp |
Seiten / Seite | 24 / 4 — MIC920. ELECTRICAL CHARACTERISTICS. Electrical Characteristics:. … |
Dateiformat / Größe | PDF / 3.3 Mb |
Dokumentensprache | Englisch |
MIC920. ELECTRICAL CHARACTERISTICS. Electrical Characteristics:. Parameters. Symbol. Min. Typ. Max. Units. Conditions
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MIC920 ELECTRICAL CHARACTERISTICS Electrical Characteristics:
V+ = +9V, V– = –9V, VCM = 0V RL = 10 MΩ; TJ = 25°C, unless otherwise noted.
Parameters Symbol Min. Typ. Max. Units Conditions
Input Offset Voltage VOS — 0.3 5 mV –40°C ≤ TJ ≤ +85°C Input Offset Voltage Temperature ΔVOS/ΔTA — 1 — μV/°C –40°C ≤ TJ ≤ +85°C Coefficient Input Bias Current IB — 0.23 0.60 μA –40°C ≤ TJ ≤ +85°C Input Offset Current IOS — 0.04 0.3 μA –40°C ≤ TJ ≤ +85°C Input Common-Mode VCM –7.25 — +7.25 V CMRR > 75 dB, –40°C ≤ TJ ≤ +85°C Range Common-Mode CMRR 60 91 — dB –6.5V < V Rejection Ratio CM < +6.5V Power Supply PSRR 95 104 — dB ±3.5V < V Rejection Ratio S < ±9V Large-Signal 75 84 — dB R A L = 2k, VOUT = ±2V Voltage Gain VOL — 93 — dB RL = 100Ω, VOUT = ±1V Positive, R 6.5 7.5 — V L = 2 kΩ, Maximum Output –40°C ≤ T V J ≤ +85°C Voltage Swing OUT Negative, R — –7.5 –6.2 V L = 2 kΩ –40°C ≤ TJ ≤ +85°C Unity Gain-Bandwidth GBW — 80 — MHz CL = 1.7 pF Product Phase Margin PM — 30 — ° — –3 dB Bandwidth BW — 115 — MHz AV = 1, CL = 1.7 pF, RL = 1 kΩ C = 1.7 pF, Gain = 1, V Slew Rate S OUT = 5V, Peak R — 3000 — V/μs to Peak, Positive SR = 2500V/μs Short-Circuit Output 50 65 — Source I mA Current SC 30 50 — Sink Supply Current IS — 0.55 0.8 mA No load, –40°C ≤ TJ ≤ +85°C Input Voltage Noise — — 10 — nV/√Hz f = 10 kHz Input Current Noise — — 0.8 — pA/√Hz f = 10 kHz DS20006268A-page 4 2019 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service