Datasheet MIC920 (Microchip) - 5
| Hersteller | Microchip |
| Beschreibung | 80 MHz Low-Power SC70 Op Amp |
| Seiten / Seite | 24 / 5 — MIC920. TEMPERATURE SPECIFICATIONS (Note. Parameters. Symbol. Min. Typ. … |
| Dateiformat / Größe | PDF / 3.3 Mb |
| Dokumentensprache | Englisch |
MIC920. TEMPERATURE SPECIFICATIONS (Note. Parameters. Symbol. Min. Typ. Max. Units. Conditions. Temperature Ranges
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MIC920 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges
Storage Temperature TS — — 150 °C — Operating Junction Temperature Range TJ –40 — +85 °C — Lead Temperature — — — 260 °C Soldering, 5 sec.
Package Thermal Resistance
Thermal Resistance SC70 — — 450 — °C/W —
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability. 2019 Microchip Technology Inc. DS20006268A-page 5 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service
MIC920 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges
Storage Temperature TS — — 150 °C — Operating Junction Temperature Range TJ –40 — +85 °C — Lead Temperature — — — 260 °C Soldering, 5 sec.
Package Thermal Resistance
Thermal Resistance SC70 — — 450 — °C/W —
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability. 2019 Microchip Technology Inc. DS20006268A-page 5 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service