Datasheet MIC920 (Microchip) - 3

HerstellerMicrochip
Beschreibung80 MHz Low-Power SC70 Op Amp
Seiten / Seite24 / 3 — MIC920. ELECTRICAL CHARACTERISTICS (±5V). Electrical Characteristics:. …
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MIC920. ELECTRICAL CHARACTERISTICS (±5V). Electrical Characteristics:. Parameters. Symbol. Min. Typ. Max. Units. Conditions

MIC920 ELECTRICAL CHARACTERISTICS (±5V) Electrical Characteristics: Parameters Symbol Min Typ Max Units Conditions

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MIC920 ELECTRICAL CHARACTERISTICS (±5V) Electrical Characteristics:
V+ = +5V, V– = –5V, VCM = 0V, RL = 10 MΩ; TA = 25°C, unless otherwise noted.
Parameters Symbol Min. Typ. Max. Units Conditions
Input Offset Voltage VOS — 0.43 5 mV –40°C ≤ TJ ≤ +85°C Input Offset Voltage Temperature ΔVOS/ΔTA — 1 — μV/°C –40°C ≤ TJ ≤ +85°C Coefficient Input Bias Current IB — 0.26 0.6 μA –40°C ≤ TJ ≤ +85°C Input Offset Current IOS — 0.04 0.3 μA –40°C ≤ TJ ≤ +85°C Input Common-Mode VCM –3.25 — +3.25 V CMRR > 72 dB, –40°C ≤ TJ ≤ +85°C Range Common-Mode CMRR 75 85 — dB –2.5V < V Rejection Ratio CM < +2.5V Power Supply PSRR 95 104 — dB ±3.5V < V Rejection Ratio S < ±9V Large-Signal 65 82 — dB RL = 2k, VOUT = ±2V A Voltage Gain VOL — 85 — dB RL = 100Ω, VOUT = ±1V Positive, R +3.0 3.6 — V L = 2 kΩ Maximum Output –40°C ≤ TJ ≤ +85°C V Voltage Swing OUT Negative, R — –3.6 –3.0 V L = 2 kΩ –40°C ≤ TJ ≤ +85°C Unity Gain-Bandwidth GBW — 67 — MHz CL = 1.7 pF Product Phase Margin PM — 32 — ° — –3 dB Bandwidth BW — 100 — MHz AV = 1, CL = 1.7 pF, RL = 1 kΩ C = 1.7 pF, Gain = 1, V Slew Rate S OUT = 5V, R — 1350 — V/μs Peak to Peak, Positive SR = 1190V/μs Short-Circuit Output 45 63 — Source I mA Current SC 20 45 — Sink Supply Current IS — 0.55 0.80 mA No load, –40°C ≤ TJ ≤ +85°C Input Voltage Noise — — 11 — nV/√Hz f = 10 kHz Input Current Noise — — 0.7 — pA/√Hz f = 10 kHz  2019 Microchip Technology Inc. DS20006268A-page 3 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service