Datasheet AD8037-EP (Analog Devices) - 5
| Hersteller | Analog Devices |
| Beschreibung | Low Distortion, Wide Bandwidth Voltage Feedback Clamp Amp |
| Seiten / Seite | 8 / 5 — Enhanced Product. AD8037-EP. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER … |
| Dateiformat / Größe | PDF / 175 Kb |
| Dokumentensprache | Englisch |
Enhanced Product. AD8037-EP. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER DISSIPATION. Table 2. Parameter Rating. W ( N. O TI. A P
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Enhanced Product AD8037-EP ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 2.
The maximum power that can be safely dissipated by these devices
Parameter Rating
is limited by the associated rise in junction temperature. The Supply Voltage 12.6 V maximum safe junction temperature for plastic encapsulated Power Dissipation See Figure 2 devices is determined by the glass transition temperature of the Voltage Swing × Bandwidth Product 350 V-MHz plastic, approximately 150oC. Exceeding this limit temporarily may Common-Mode Input Voltage ±VS cause a shift in parametric performance due to a change in the |VH – VIN| ≤6.3 V stresses exerted on the die by the package. Exceeding a junction |VL – VIN| ≤6.3 V temperature of 175oC for an extended period can result in Differential Input Voltage ±1.2 V device failure. Storage Temperature Range −65°C to +125°C Operating Temperature Range −55°C to +105°C Although the AD8037-EP is internally short-circuit protected, Lead Temperature (Soldering, 10 sec) 300°C this may not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all Stresses at or above those listed under Absolute Maximum conditions. To ensure proper operation, it is necessary to observe Ratings may cause permanent damage to the product. This is a the maximum power derating curves. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
)
section of this specification is not implied. Operation beyond
W ( N
the maximum operating conditions for extended periods may
O TI
affect product reliability.
A P THERMAL RESISTANCE ISSI D R E
Thermal performance is directly linked to printed circuit board
W O
(PCB) design and operating environment. Careful attention to
P M
PCB thermal design is required.
MU XI MA Table 3. Thermal Resistance Package Type θJA Unit
2 R-8 155 °C/W -00
AMBIENT TEMPERATURE (°C)
760 13 Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. 0 | Page 5 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
Enhanced Product AD8037-EP ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 2.
The maximum power that can be safely dissipated by these devices
Parameter Rating
is limited by the associated rise in junction temperature. The Supply Voltage 12.6 V maximum safe junction temperature for plastic encapsulated Power Dissipation See Figure 2 devices is determined by the glass transition temperature of the Voltage Swing × Bandwidth Product 350 V-MHz plastic, approximately 150oC. Exceeding this limit temporarily may Common-Mode Input Voltage ±VS cause a shift in parametric performance due to a change in the |VH – VIN| ≤6.3 V stresses exerted on the die by the package. Exceeding a junction |VL – VIN| ≤6.3 V temperature of 175oC for an extended period can result in Differential Input Voltage ±1.2 V device failure. Storage Temperature Range −65°C to +125°C Operating Temperature Range −55°C to +105°C Although the AD8037-EP is internally short-circuit protected, Lead Temperature (Soldering, 10 sec) 300°C this may not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all Stresses at or above those listed under Absolute Maximum conditions. To ensure proper operation, it is necessary to observe Ratings may cause permanent damage to the product. This is a the maximum power derating curves. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
)
section of this specification is not implied. Operation beyond
W ( N
the maximum operating conditions for extended periods may
O TI
affect product reliability.
A P THERMAL RESISTANCE ISSI D R E
Thermal performance is directly linked to printed circuit board
W O
(PCB) design and operating environment. Careful attention to
P M
PCB thermal design is required.
MU XI MA Table 3. Thermal Resistance Package Type θJA Unit
2 R-8 155 °C/W -00
AMBIENT TEMPERATURE (°C)
760 13 Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. 0 | Page 5 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE