Datasheet LTC2259-16 (Analog Devices) - 2
Hersteller | Analog Devices |
Beschreibung | 16-Bit, 80Msps Ultralow Power 1.8V ADC |
Seiten / Seite | 30 / 2 — ABSOLUTE MAXIMUM RATINGS (Notes 1, 2). PIN CONFIGURATION |
Dateiformat / Größe | PDF / 371 Kb |
Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2). PIN CONFIGURATION
Modelllinie für dieses Datenblatt
Textversion des Dokuments
LTC2259-16
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2)
Supply Voltages (VDD, OVDD) ... –0.3V to 2V Digital Output Voltage .. –0.3V to (OVDD + 0.3V) Analog Input Voltage (A + – IN , AIN , Operating Temperature Range: PAR/SER, SENSE) (Note 3) .. –0.3V to (VDD + 0.2V) LTC2259C .. 0°C to 70°C Digital Input Voltage (ENC+, ENC–, CS, LTC2259I ... –40°C to 85°C SDI, SCK) (Note 4) .. –0.3V to 3.9V Storage Temperature Range .. –65°C to 150°C SDO (Note 4) ... –0.3V to 3.9V
PIN CONFIGURATION
FULL-RATE CMOS OUTPUT MODE DOUBLE DATA RATE CMOS OUTPUT MODE TOP VIEW TOP VIEW DD REF CM V SENSE V V D1 D0 D15 D14 D13 D12 DD REF CM V SENSE V V D0_1 DNC D14_15 DNC D12_13 DNC 40 39 38 37 36 35 34 33 32 31 40 39 38 37 36 35 34 33 32 31 A + + IN 1 30 D11 AIN 1 30 D10_11 A – 2 29 – IN D10 A 2 29 IN DNC GND 3 28 CLKOUT+ GND 3 28 CLKOUT+ REFH 4 27 CLKOUT– REFH 4 27 CLKOUT– REFH 5 41 26 OVDD REFH 5 41 26 OVDD GND REFL 6 25 OGND GND REFL 6 25 OGND REFL 7 24 D9 REFL 7 24 D8_9 PAR/SER 8 23 D8 PAR/SER 8 23 DNC V 9 DD 22 D7 V 9 DD 22 D6_7 VDD 10 21 D6 VDD 10 21 DNC 11 12 13 14 15 16 17 18 19 20 11 12 13 14 15 16 17 18 19 20 + – CS D2 D3 D4 D5 + – CS ENC ENC SCK SDI SDO ENC ENC SCK SDI SDO DNC D2_3 DNC D4_5 UJ PACKAGE UJ PACKAGE 40-LEAD (6mm s 6mm) PLASTIC QFN 40-LEAD (6mm s 6mm) PLASTIC QFN TJMAX = 150°C, θJA = 32°C/W TJMAX = 150°C, θJA = 32°C/W EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB DOUBLE DATA RATE LVDS OUTPUT MODE TOP VIEW + – + – + – DD REF CM V SENSE V V DO_1 D0_1 D14_15 D14_15 D12_13 D12_13 40 39 38 37 36 35 34 33 32 31 A + IN 1 30 D10_11+ A – 2 29 IN D10_11– GND 3 28 CLKOUT+ REFH 4 27 CLKOUT– REFH 5 41 26 OVDD GND REFL 6 25 OGND REFL 7 24 D8_9+ PAR/SER 8 23 D8_9– V 9 DD 22 D6_7+ VDD 10 21 D6_7– 11 12 13 14 15 16 17 18 19 20 + – CS – + – + ENC ENC SCK SDI SDO D2_3 D2_3 D4_5 D4_5 UJ PACKAGE 40-LEAD (6mm s 6mm) PLASTIC QFN TJMAX = 150°C, θJA = 32°C/W EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB 225916fa 2