Datasheet CD4001B, CD4002B, CD4025B (Texas Instruments) - 7
| Hersteller | Texas Instruments |
| Seiten / Seite | 20 / 7 — PACKAGE OPTION ADDENDUM. Orderable Device. Status. Package Type Package … |
| Revision | C |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
PACKAGE OPTION ADDENDUM. Orderable Device. Status. Package Type Package Pins Package. Eco Plan. Lead/Ball Finish. MSL Peak Temp
Textversion des Dokuments
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1)
Drawing Qty
(2) (6) (3) (4/5) CD4025BMG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025BM & no Sb/Br) CD4025BMT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025BM & no Sb/Br) CD4025BNSR ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025B & no Sb/Br) CD4025BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025B & no Sb/Br) CD4025BPW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B & no Sb/Br) CD4025BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B & no Sb/Br) JM38510/05252BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05252BCA JM38510/05254BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05254BCA M38510/05252BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05252BCA M38510/05254BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05254BCA
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 3
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1)
Drawing Qty
(2) (6) (3) (4/5) CD4025BMG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025BM & no Sb/Br) CD4025BMT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025BM & no Sb/Br) CD4025BNSR ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025B & no Sb/Br) CD4025BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4025B & no Sb/Br) CD4025BPW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B & no Sb/Br) CD4025BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM025B & no Sb/Br) JM38510/05252BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05252BCA JM38510/05254BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05254BCA M38510/05252BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05252BCA M38510/05254BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05254BCA
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 3