Datasheet CD4001B, CD4002B, CD4025B (Texas Instruments) - 10
| Hersteller | Texas Instruments |
| Seiten / Seite | 20 / 10 — PACKAGE MATERIALS INFORMATION. Device. Package Type. Package Drawing. … |
| Revision | C |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
PACKAGE MATERIALS INFORMATION. Device. Package Type. Package Drawing. Pins. SPQ. Length (mm). Width (mm). Height (mm)
Textversion des Dokuments
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Aug-2014 *All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4001BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4001BMT SOIC D 14 250 367.0 367.0 38.0 CD4001BNSR SO NS 14 2000 367.0 367.0 38.0 CD4001BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4002BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4002BNSR SO NS 14 2000 367.0 367.0 38.0 CD4002BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4025BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4025BMT SOIC D 14 250 367.0 367.0 38.0 CD4025BNSR SO NS 14 2000 367.0 367.0 38.0 Pack Materials-Page 2
www.ti.com 18-Aug-2014 *All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4001BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4001BMT SOIC D 14 250 367.0 367.0 38.0 CD4001BNSR SO NS 14 2000 367.0 367.0 38.0 CD4001BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4002BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4002BNSR SO NS 14 2000 367.0 367.0 38.0 CD4002BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4025BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4025BMT SOIC D 14 250 367.0 367.0 38.0 CD4025BNSR SO NS 14 2000 367.0 367.0 38.0 Pack Materials-Page 2