Datasheet Si7611DN (Vishay) - 9
| Hersteller | Vishay |
| Beschreibung | P-Channel 40-V (D-S) MOSFET |
| Seiten / Seite | 13 / 9 — AN822. PowerPAK 1212 DUAL. REFLOW SOLDERING. Figure 2. Figure 3 |
| Dateiformat / Größe | PDF / 579 Kb |
| Dokumentensprache | Englisch |
AN822. PowerPAK 1212 DUAL. REFLOW SOLDERING. Figure 2. Figure 3
Modelllinie für dieses Datenblatt
Textversion des Dokuments
AN822
Vishay Siliconix
PowerPAK 1212 DUAL
To take the advantage of the dual PowerPAK 1212-8’s ture profile used, and the temperatures and time thermal performance, the minimum recommended duration, are shown in Figures 2 and 3. For the lead land pattern can be found in Application Note 826, (Pb)-free solder profile, see http://www.vishay.com/ Recommended Minimum Pad Patterns With Outline doc?73257. Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 dual in the index of this doc- ument. The gap between the two drain pads is 10 mils. This matches the spacing of the two drain pads on the Pow- erPAK 1212-8 dual package. This land pattern can be extended to the left, right, and top of the drawn pattern. This extension will serve to increase the heat dissipation by decreasing the ther- mal resistance from the foot of the PowerPAK to the PC board and therefore to the ambient. Note that increasing the drain land area beyond a certain point will yield little decrease in foot-to-board and foot-to- ambient thermal resistance. Under specific conditions of board configuration, copper weight, and layer stack, experiments have found that adding copper beyond an Ramp-Up Rate + 6 °C /Second Maximum area of about 0.3 to 0.5 in2 of will yield little improve- Temperature at 155 ± 15 °C 120 Seconds Maximum ment in thermal performance. Temperature Above 180 °C 70 - 180 Seconds Maximum Temperature 240 + 5/- 0 °C Time at Maximum Temperature 20 - 40 Seconds
REFLOW SOLDERING
Ramp-Down Rate + 6 °C/Second Maximum Vishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected
Figure 2.
Solder Reflow Temperature Profile to solder reflow as a preconditioning test and are then reliability-tested using temperature cycle, bias humid- ity, HAST, or pressure pot. The solder reflow tempera- 10 s (max) 210 - 220 °C 3 ° C/s (max) 4 ° C/s (max) 183 °C 140 - 170 °C 50 s (max) 3° C/s (max) 60 s (min) Reflow Zone Pre-Heating Zone Maximum peak temperature at 240 °C is allowed.
Figure 3.
Solder Reflow Temperatures and Time Durations www.vishay.com Document Number 71681 2 03-Mar-06
Vishay Siliconix
PowerPAK 1212 DUAL
To take the advantage of the dual PowerPAK 1212-8’s ture profile used, and the temperatures and time thermal performance, the minimum recommended duration, are shown in Figures 2 and 3. For the lead land pattern can be found in Application Note 826, (Pb)-free solder profile, see http://www.vishay.com/ Recommended Minimum Pad Patterns With Outline doc?73257. Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 dual in the index of this doc- ument. The gap between the two drain pads is 10 mils. This matches the spacing of the two drain pads on the Pow- erPAK 1212-8 dual package. This land pattern can be extended to the left, right, and top of the drawn pattern. This extension will serve to increase the heat dissipation by decreasing the ther- mal resistance from the foot of the PowerPAK to the PC board and therefore to the ambient. Note that increasing the drain land area beyond a certain point will yield little decrease in foot-to-board and foot-to- ambient thermal resistance. Under specific conditions of board configuration, copper weight, and layer stack, experiments have found that adding copper beyond an Ramp-Up Rate + 6 °C /Second Maximum area of about 0.3 to 0.5 in2 of will yield little improve- Temperature at 155 ± 15 °C 120 Seconds Maximum ment in thermal performance. Temperature Above 180 °C 70 - 180 Seconds Maximum Temperature 240 + 5/- 0 °C Time at Maximum Temperature 20 - 40 Seconds
REFLOW SOLDERING
Ramp-Down Rate + 6 °C/Second Maximum Vishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected
Figure 2.
Solder Reflow Temperature Profile to solder reflow as a preconditioning test and are then reliability-tested using temperature cycle, bias humid- ity, HAST, or pressure pot. The solder reflow tempera- 10 s (max) 210 - 220 °C 3 ° C/s (max) 4 ° C/s (max) 183 °C 140 - 170 °C 50 s (max) 3° C/s (max) 60 s (min) Reflow Zone Pre-Heating Zone Maximum peak temperature at 240 °C is allowed.
Figure 3.
Solder Reflow Temperatures and Time Durations www.vishay.com Document Number 71681 2 03-Mar-06