Preliminary Datasheet EPC2103 (Efficient Power Conversion) - 9

HerstellerEfficient Power Conversion
BeschreibungEnhancement-Mode GaN Power Transistor Half Bridge
Seiten / Seite10 / 9 — EPC2103 – Enhancement-Mode GaN Power Transistor Half Bridge. Preliminary …
Dateiformat / GrößePDF / 1.3 Mb
DokumentenspracheEnglisch

EPC2103 – Enhancement-Mode GaN Power Transistor Half Bridge. Preliminary Specification Sheet

EPC2103 – Enhancement-Mode GaN Power Transistor Half Bridge Preliminary Specification Sheet

Modelllinie für dieses Datenblatt

EPC2103

Textversion des Dokuments

EPC2103 – Enhancement-Mode GaN Power Transistor Half Bridge Preliminary Specification Sheet RECOMMENDED LAND PATTERN (Units in µm) RECOMMENDED STENCIL DESIGN (Units in µm) Recommended stencil should be 4mil (100µm) thick, must be laser cut, openings per drawing. Intended for use with SAC305 Type 4 solder, reference 88.5% metals content Additional assembly resources available at http://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx
Subject to Change without Notice www.epc-co.com COPYRIGHT 2015 Page 9