Datasheet OPA205, OPA2205, OPA4205 (Texas Instruments) - 7
Hersteller | Texas Instruments |
Beschreibung | Dual, rail-to-rail bipolar precision e-trim op amp with low input bias current and low noise |
Seiten / Seite | 47 / 7 — OPA205. , OPA2205. , OPA4205. www.ti.com. 6.4 Thermal Information: … |
Dateiformat / Größe | PDF / 3.0 Mb |
Dokumentensprache | Englisch |
OPA205. , OPA2205. , OPA4205. www.ti.com. 6.4 Thermal Information: OPA205. THERMAL METRIC. D (SOIC). UNIT. 8 PINS

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OPA205 , OPA2205 , OPA4205 www.ti.com
SBOS962F – APRIL 2020 – REVISED MARCH 2023
6.4 Thermal Information: OPA205 OPA205 THERMAL METRIC
(1)
D (SOIC) UNIT 8 PINS
RθJA Junction-to-ambient thermal resistance 121.5 ℃/W RθJC(top) Junction-to-case (top) thermal resistance 64.3 ℃/W RθJB Junction-to-board thermal resistance 65.0 ℃/W ψJT Junction-to-top characterization parameter 18.2 ℃/W ψJB Junction-to-board characterization parameter 64.3 ℃/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A ℃/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Thermal Information: OPA2205 OPA2205 THERMAL METRIC
(1)
D (SOIC) DGK (VSSOP) UNIT 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 126.9 175.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 67.1 63.1 °C/W RθJB Junction-to-board thermal resistance 70.3 97.2 °C/W ψJT Junction-to-top characterization parameter 18.8 7.8 °C/W ψJB Junction-to-board characterization parameter 69.5 95.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.6 Thermal Information: OPA4205 OPA4205 THERMAL METRIC
(1)
D (SOIC) PW (TSSOP) UNIT 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 86.5 117.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 38.5 36.0 °C/W RθJB Junction-to-board thermal resistance 43.5 59.3 °C/W ψJT Junction-to-top characterization parameter 7.4 2.6 °C/W ψJB Junction-to-board characterization parameter 42.9 58.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: OPA205 OPA2205 OPA4205 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information: OPA205 6.5 Thermal Information: OPA2205 6.6 Thermal Information: OPA4205 6.7 Electrical Characteristics: VS = ±5 V 6.8 Electrical Characteristics: VS = ±15 V 6.9 Typical Characteristics 7 Parameter Measurement Information 7.1 Typical Specifications and Distributions 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Input Offset Trimming 8.3.2 Lower Input Bias With Super-Beta Inputs 8.3.3 Overload Power Limiter 8.3.4 EMI Rejection 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 High-Precision Signal-Chain Input Buffer 9.2.1.1 Design Requirements 9.2.1.2 Detailed Design Procedure 9.2.1.3 Application Curves 9.2.2 Discrete, Two-Op-Amp Instrumentation Amplifier 9.2.3 Second-Order Low-Pass Filter 9.3 Power Supply Recommendations 9.4 Layout 9.4.1 Layout Guidelines 9.4.2 Layout Example 10 Device and Documentation Support 10.1 Device Support 10.1.1 Development Support 10.1.1.1 PSpice® for TI 10.2 Documentation Support 10.2.1 Related Documentation 10.3 Receiving Notification of Documentation Updates 10.4 Support Resources 10.5 Trademarks 10.6 Electrostatic Discharge Caution 10.7 Glossary 11 Mechanical, Packaging, and Orderable Information