Datasheet ESP32-H2-WROOM-07 (Espressif) - 7

HerstellerEspressif
BeschreibungBluetooth Low Energy and IEEE 802.15.4 module
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DokumentenspracheEnglisch

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link to page 8 link to page 9 link to page 12 link to page 32 link to page 33 link to page 34 link to page 35 link to page 36 List of Figures List of Figures 1 Block Diagram 8 2 Pin Layout (Top View and Bottom View) 9 3 Visualization of Timing Parameters for the Strapping Pins 12 4 Schematics 32 5 Peripheral Schematics 33 6 Physical Dimensions 34 7 Recommended PCB Land Pattern 35 8 Wave Soldering Profile 36 Espressif Systems 7 ESP32-H2-WROOM-07 Datasheet v1.0 Document Outline 1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 ROM Messages Printing Control 4.3 JTAG Signal Source Control 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interfaces 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 I2S Controller 5.2.1.5 Pulse Count Controller 5.2.1.6 USB Serial/JTAG Controller 5.2.1.7 Two-wire Automotive Interface 5.2.1.8 LED PWM Controller 5.2.1.9 Motor Control PWM 5.2.1.10 Remote Control Peripheral 5.2.1.11 Parallel IO Controller 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 5.2.2.3 Analog PAD Voltage Comparator 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 7 RF Characteristics 7.1 Bluetooth LE Radio 7.1.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.1.2 Bluetooth LE RF Receiver (RX) Characteristics 7.2 802.15.4 Radio 7.2.1 802.15.4 RF Transmitter (TX) Characteristics 7.2.2 802.15.4 RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Module Dimensions 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Soldering Profile 12.3.1 Wave Profile 12.4 Ultrasonic Vibration Related Documentation and Resources Revision History