Datasheet ESP32-H2-WROOM-07 (Espressif) - 8
Hersteller | Espressif |
Beschreibung | Bluetooth Low Energy and IEEE 802.15.4 module |
Seiten / Seite | 39 / 8 — 2. Block. Diagram. 2. Block. Diagram. 32. MHz. 3V3. Crystal. Antenna. RF. … |
Dateiformat / Größe | PDF / 594 Kb |
Dokumentensprache | Englisch |
2. Block. Diagram. 2. Block. Diagram. 32. MHz. 3V3. Crystal. Antenna. RF. Matching. ESP32-H2. GPIOs. SPI. Flash. GND. Figure. 1:. Block. Diagram. Espressif. Systems. 8
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2 Block Diagram 2 Block Diagram 32 MHz 3V3 Crystal Antenna RF Matching ESP32-H2 GPIOs SPI Flash GND Figure 1: Block Diagram Espressif Systems 8 ESP32-H2-WROOM-07 Datasheet v1.0 Document Outline 1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 ROM Messages Printing Control 4.3 JTAG Signal Source Control 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interfaces 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 I2S Controller 5.2.1.5 Pulse Count Controller 5.2.1.6 USB Serial/JTAG Controller 5.2.1.7 Two-wire Automotive Interface 5.2.1.8 LED PWM Controller 5.2.1.9 Motor Control PWM 5.2.1.10 Remote Control Peripheral 5.2.1.11 Parallel IO Controller 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 5.2.2.3 Analog PAD Voltage Comparator 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 7 RF Characteristics 7.1 Bluetooth LE Radio 7.1.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.1.2 Bluetooth LE RF Receiver (RX) Characteristics 7.2 802.15.4 Radio 7.2.1 802.15.4 RF Transmitter (TX) Characteristics 7.2.2 802.15.4 RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Module Dimensions 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Soldering Profile 12.3.1 Wave Profile 12.4 Ultrasonic Vibration Related Documentation and Resources Revision History