Datasheet ADRF5031 (Analog Devices) - 5

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ADRF5031 ABSOLUTE MAXIMUM RATINGS
For the recommended operating conditions, see Table 1.
THERMAL RESISTANCE Table 3. Absolute Maximum Ratings
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Careful attention to PCB Positive Supply Voltage −0.3 V to +3.6 V thermal design is required. Negative Supply Voltage −3.6 V to +0.3 V θJC is the junction-to-case bottom (channel-to-package bottom) Digital Control Input1 thermal resistance. Voltage −0.3 V to VDD + 0.3 V
Table 4. Thermal Resistance
Current 3 mA
1
RF Input Power, Dual Supply2 (V
Package Type θJC Unit
DD = 3.3 V, VSS = −3.3 V, f = 1 MHz to 20 GHz, TCASE = 85°C3) CC-20-21 Through Path Through Path 110 °C/W Average 34 dBm Terminated Path 50 °C/W Peak 36 dBm 1 θJC was determined by simulation under the following conditions: the heat Terminated Path transfer is due solely to the thermal conduction from the channel through the Average 30.5 dBm ground pad to the PCB, and the ground pad is held constant at the operating Peak 32.5 dBm temperature of 85°C. Hot Switching (RFC)
POWER DERATING CURVE
Average 33.5 dBm Peak 35.5 dBm Hot Switching (RFx) Average 30.5 dBm Peak 32.5 dBm RF Input Power, Single Supply (VDD = 3.3 V, VSS = 0 V, f = 1 MHz to 20 GHz, TCASE = 85°C) Through Path 25 dBm Terminated Path 25 dBm Hot Switching (RFC) 25 dBm RF Input Power, Unbiased (VDD, VSS = 0 V) Average 31 dBm Peak4 36 dBm Temperature Junction, TJ 135°C Storage Range −65°C to +150°C
Figure 2. Power Derating vs. Frequency, Low-Frequency Detail, TCASE = 85°C
Reflow 260°C 1 Overvoltages at the digital control input are clamped by internal diodes. Current must be limited to the maximum rating given. 2 For power derating over frequency, see Figure 2. 3 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB for dual supply. 4 Peak: (≤100 ns pulse duration, 5% duty cycle). Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time.
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Document Outline Features Applications Functional Block Diagram General Description Specifications Single-Supply Operation Absolute Maximum Ratings Thermal Resistance Power Derating Curve Electrostatic Discharge (ESD) Ratings ESD Ratings for the ADRF5031 ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Insertion Loss, Return Loss, and Isolation Input Power Compression and Third-Order Intercept Theory of Operation RF Input and Output Power Supply Applications Information Recommendations for PCB Design Outline Dimensions Ordering Guide Evaluation Boards