Datasheet REF34-Q1 (Texas Instruments) - 4

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REF34-Q1
SBAS901C – JULY 2018 – REVISED OCTOBER 2020
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
IN –0.3 13 V Input voltage EN –0.3 IN + 0.3 V Output voltage VOUT –0.3 5.5 V Output short circuit current 20 mA Operating temperature range, TA –55 150 °C Storage temperature range, Tstg –65 170 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions beyond those specified in the Electrical Characteristics Table is not implied.
7.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per AEC Q100-002(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC ±1500 Q100-011 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V IN Input Voltage OUT + V (1) 12 V DO EN Enable Voltage 0 IN V IL Output Current –10 10 mA TA Operating Temperature –40 25 125 °C (1) VDO = Dropout voltage
7.4 Thermal Information REF34-Q1 THERMAL METRIC(1) DBV DBV DGK UNIT 5 PINS 6 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 122.6 122.6 174.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 80.2 80.2 61.3 °C/W RθJB Junction-to-board thermal resistance 42 42 95.5 °C/W ΨJT Junction-to-top characterization parameter 23.2 23.2 8.5 °C/W ΨJB Junction-to-board characterization parameter 41.9 41.9 93.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: REF34-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 6.1 Pin Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 8 Typical Characteristics 9 Parameter Measurement Information 9.1 Solder Heat Shift 9.2 Long-Term Stability 9.3 Thermal Hysteresis 9.4 Power Dissipation 9.5 Noise Performance 10 Detailed Description 10.1 Overview 10.2 Functional Block Diagram 10.3 Feature Description 10.3.1 Supply Voltage 10.3.2 Low Temperature Drift 10.3.3 Load Current 10.4 Device Functional Modes 10.4.1 EN Pin 11 Application and Implementation 11.1 Application Information 11.2 Typical Applications 11.2.1 Basic Voltage Reference Connection 11.2.1.1 Design Requirements 11.2.1.2 Detailed Design Procedure 11.2.1.2.1 Input and Output Capacitors 11.2.1.2.2 4-Wire Kelvin Connections 11.2.1.2.3 V​IN Slew Rate Considerations 11.2.1.2.4 Shutdown/Enable Feature 11.2.1.3 Application Curves 11.2.2 Advanced Driver Assistance Systems (ADAS) Microcontroller Connection 11.2.2.1 Basic Voltage Reference Connection 11.2.2.2 Design Requirements 11.2.2.3 Detailed Design Procedure 11.2.2.4 Enable Feature in ADAS 12 Power Supply Recommendations 13 Layout 13.1 Layout Guidelines 13.2 Layout Example 14 Device and Documentation Support 14.1 Documentation Support 14.1.1 Related Documentation 14.2 Receiving Notification of Documentation Updates 14.3 Support Resources 14.4 Trademarks 14.5 Electrostatic Discharge Caution 14.6 Glossary 15 Mechanical, Packaging, and Orderable Information