Datasheet REF34-Q1 (Texas Instruments) - 10
| Hersteller | Texas Instruments |
| Beschreibung | Automotive, low-drift, low-power, small-footprint series voltage reference |
| Seiten / Seite | 39 / 10 — REF34-Q1. www.ti.com. 8 Typical Characteristics (continued). Figure 8-19. … |
| Dateiformat / Größe | PDF / 4.5 Mb |
| Dokumentensprache | Englisch |
REF34-Q1. www.ti.com. 8 Typical Characteristics (continued). Figure 8-19. Thermal Hysteresis Distribution (Cycle 1) - DGK
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REF34-Q1
SBAS901C – JULY 2018 – REVISED OCTOBER 2020
www.ti.com 8 Typical Characteristics (continued)
at TA = 25°C, VIN = VEN = 12 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted) 30% 30% 25% 25% 20% 20% %) (%) on ( 15% 15% Populati 10% Population 10% 5% 5% 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2 -9 -6 -3 3 6 9 -4 -3 -2 -1 1 2 3 4 -1 120 DGKt Thermal Hysteresis - Cycle 2 (ppm) DGKt Thermal Hysteresis - Cycle 1 (ppm)
Figure 8-19. Thermal Hysteresis Distribution (Cycle 1) - DGK Figure 8-20. Thermal Hysteresis Distribution (Cycle 2) - DGK Package Package
50% 50% 40% 40% ) (%) 30% (% 30% ion ion lat opulat 20% 20% P Popu 10% 10% 0 0 0 01 02 0 -0.02 -0.01 0. 0. 0.01 0.02 D017 -0.02 -0.01 DGKs Solder Heat Shift (%) Solder Heat Shift (%) Refer to Section 9.1 for more information Refer to Section 9.1 for more information
Figure 8-21. Solder Heat Shift Distribution - DBV Package Figure 8-22. Solder Heat Shift Distribution - DGK Package
En 1V/div /div V 2µ VOUT Time 1s/div 0.5ms/div D08_ D018
Figure 8-24. 0.1-Hz to 10-Hz Noise (VREF) Figure 8-23. Turnon Time (Enable)
10 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: REF34-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 6.1 Pin Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 8 Typical Characteristics 9 Parameter Measurement Information 9.1 Solder Heat Shift 9.2 Long-Term Stability 9.3 Thermal Hysteresis 9.4 Power Dissipation 9.5 Noise Performance 10 Detailed Description 10.1 Overview 10.2 Functional Block Diagram 10.3 Feature Description 10.3.1 Supply Voltage 10.3.2 Low Temperature Drift 10.3.3 Load Current 10.4 Device Functional Modes 10.4.1 EN Pin 11 Application and Implementation 11.1 Application Information 11.2 Typical Applications 11.2.1 Basic Voltage Reference Connection 11.2.1.1 Design Requirements 11.2.1.2 Detailed Design Procedure 11.2.1.2.1 Input and Output Capacitors 11.2.1.2.2 4-Wire Kelvin Connections 11.2.1.2.3 VIN Slew Rate Considerations 11.2.1.2.4 Shutdown/Enable Feature 11.2.1.3 Application Curves 11.2.2 Advanced Driver Assistance Systems (ADAS) Microcontroller Connection 11.2.2.1 Basic Voltage Reference Connection 11.2.2.2 Design Requirements 11.2.2.3 Detailed Design Procedure 11.2.2.4 Enable Feature in ADAS 12 Power Supply Recommendations 13 Layout 13.1 Layout Guidelines 13.2 Layout Example 14 Device and Documentation Support 14.1 Documentation Support 14.1.1 Related Documentation 14.2 Receiving Notification of Documentation Updates 14.3 Support Resources 14.4 Trademarks 14.5 Electrostatic Discharge Caution 14.6 Glossary 15 Mechanical, Packaging, and Orderable Information
REF34-Q1
SBAS901C – JULY 2018 – REVISED OCTOBER 2020
www.ti.com 8 Typical Characteristics (continued)
at TA = 25°C, VIN = VEN = 12 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted) 30% 30% 25% 25% 20% 20% %) (%) on ( 15% 15% Populati 10% Population 10% 5% 5% 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2 -9 -6 -3 3 6 9 -4 -3 -2 -1 1 2 3 4 -1 120 DGKt Thermal Hysteresis - Cycle 2 (ppm) DGKt Thermal Hysteresis - Cycle 1 (ppm)
Figure 8-19. Thermal Hysteresis Distribution (Cycle 1) - DGK Figure 8-20. Thermal Hysteresis Distribution (Cycle 2) - DGK Package Package
50% 50% 40% 40% ) (%) 30% (% 30% ion ion lat opulat 20% 20% P Popu 10% 10% 0 0 0 01 02 0 -0.02 -0.01 0. 0. 0.01 0.02 D017 -0.02 -0.01 DGKs Solder Heat Shift (%) Solder Heat Shift (%) Refer to Section 9.1 for more information Refer to Section 9.1 for more information
Figure 8-21. Solder Heat Shift Distribution - DBV Package Figure 8-22. Solder Heat Shift Distribution - DGK Package
En 1V/div /div V 2µ VOUT Time 1s/div 0.5ms/div D08_ D018
Figure 8-24. 0.1-Hz to 10-Hz Noise (VREF) Figure 8-23. Turnon Time (Enable)
10 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: REF34-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 6.1 Pin Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 8 Typical Characteristics 9 Parameter Measurement Information 9.1 Solder Heat Shift 9.2 Long-Term Stability 9.3 Thermal Hysteresis 9.4 Power Dissipation 9.5 Noise Performance 10 Detailed Description 10.1 Overview 10.2 Functional Block Diagram 10.3 Feature Description 10.3.1 Supply Voltage 10.3.2 Low Temperature Drift 10.3.3 Load Current 10.4 Device Functional Modes 10.4.1 EN Pin 11 Application and Implementation 11.1 Application Information 11.2 Typical Applications 11.2.1 Basic Voltage Reference Connection 11.2.1.1 Design Requirements 11.2.1.2 Detailed Design Procedure 11.2.1.2.1 Input and Output Capacitors 11.2.1.2.2 4-Wire Kelvin Connections 11.2.1.2.3 VIN Slew Rate Considerations 11.2.1.2.4 Shutdown/Enable Feature 11.2.1.3 Application Curves 11.2.2 Advanced Driver Assistance Systems (ADAS) Microcontroller Connection 11.2.2.1 Basic Voltage Reference Connection 11.2.2.2 Design Requirements 11.2.2.3 Detailed Design Procedure 11.2.2.4 Enable Feature in ADAS 12 Power Supply Recommendations 13 Layout 13.1 Layout Guidelines 13.2 Layout Example 14 Device and Documentation Support 14.1 Documentation Support 14.1.1 Related Documentation 14.2 Receiving Notification of Documentation Updates 14.3 Support Resources 14.4 Trademarks 14.5 Electrostatic Discharge Caution 14.6 Glossary 15 Mechanical, Packaging, and Orderable Information