Datasheet FFB2222A, FMB2222A, MMPQ2222A (ON Semiconductor) - 10
| Hersteller | ON Semiconductor |
| Beschreibung | NPN Multi-Chip General-Purpose Amplifier |
| Seiten / Seite | 11 / 10 — 10.00. 9.80. 8.89 16 A 8.89 9 1.75 B 6.00 4.00. 3.80 1 PIN #1. (0.30) … |
| Dateiformat / Größe | PDF / 672 Kb |
| Dokumentensprache | Englisch |
10.00. 9.80. 8.89 16 A 8.89 9 1.75 B 6.00 4.00. 3.80 1 PIN #1. (0.30) 0.51. 1.27 0.31 3.85. 7.35 8 0.25 1.27. 0.65
Modelllinie für dieses Datenblatt
Textversion des Dokuments
10.00
9.80
8.89 16 A 8.89 9 1.75 B 6.00 4.00
3.80 1 PIN #1
(0.30) 0.51
1.27 0.31 3.85
7.35 8 0.25 1.27
0.65
LAND PATTERN RECOMMENDATION C B A TOP VIEW
1.75 MAX
1.50
1.25 SEE DETAIL A 0.25
0.05
C FRONT VIEW 0.50
0.25 R0.10 GAGE PLANE R0.10 0.90
0.50 0.36 SEATING PLANE (1.04)
DETAIL A
SCALE: 2:1 0.10 C 0.25
0.19 NOTES:
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AC, ISSUE C.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS
D) CONFORMS TO ASME Y14.5M-2009
E) LANDPATTERN STANDARD:
SOIC127P600X175-16AM
F) DRAWING FILE NAME: M16AREV13.
9.80
8.89 16 A 8.89 9 1.75 B 6.00 4.00
3.80 1 PIN #1
(0.30) 0.51
1.27 0.31 3.85
7.35 8 0.25 1.27
0.65
LAND PATTERN RECOMMENDATION C B A TOP VIEW
1.75 MAX
1.50
1.25 SEE DETAIL A 0.25
0.05
C FRONT VIEW 0.50
0.25 R0.10 GAGE PLANE R0.10 0.90
0.50 0.36 SEATING PLANE (1.04)
DETAIL A
SCALE: 2:1 0.10 C 0.25
0.19 NOTES:
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AC, ISSUE C.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS
D) CONFORMS TO ASME Y14.5M-2009
E) LANDPATTERN STANDARD:
SOIC127P600X175-16AM
F) DRAWING FILE NAME: M16AREV13.