Datasheet TDA6107AJF (Philips) - 9
Hersteller | Philips |
Beschreibung | Triple Video Output Amplifier |
Seiten / Seite | 16 / 9 — Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Fig 8 |
Dateiformat / Größe | PDF / 97 Kb |
Dokumentensprache | Englisch |
Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Fig 8
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Philips Semiconductors TDA6107AJF Triple video output amplifier
2.96 Vi (V) 2.34 t 1.73 tst 150 140 Voc (V) 100 Ov (in %) 51 60 50 49 t toc(f) tco(p) mce476
Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edge as a function of the AC input signal 10. Application information 10.1 Cathode output
The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance flash) of 3 A maximum with a charge content of 100 µC. External protection against higher currents is described in Application note AN10227-01. The cathode is also protected against peak currents (caused by positive voltage peaks during low-resistance flash) of 6 A maximum with a charge content of 100 nC. External protection against higher currents is described in Application note AN10227-01. The DC voltage of pin VDD must be within the operating range of 180 V to 210 V during the peak currents.
10.2 Flashover protection
The TDA6107AJF incorporates protection diodes against CRT flashover discharges that clamp the cathodes output voltage up to a maximum of VDD + Vd. 9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 9 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents