Datasheet NCV7329 (ON Semiconductor) - 3
| Hersteller | ON Semiconductor |
| Beschreibung | Stand-Alone LIN Transceiver |
| Seiten / Seite | 14 / 3 — NCV7329. Table 2. ABSOLUTE MAXIMUM RATINGS. Symbol. Parameter. Min. Max. … |
| Dateiformat / Größe | PDF / 381 Kb |
| Dokumentensprache | Englisch |
NCV7329. Table 2. ABSOLUTE MAXIMUM RATINGS. Symbol. Parameter. Min. Max. Unit. Table 3. THERMAL CHARACTERISTICS. Value. www.onsemi.com
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NCV7329 Table 2. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit
VBB Voltage on Pin VBB −0.3 +42 V VLIN LIN Bus Voltage with respect to GND −42 +42 V LIN Bus Voltage with respect to VBB −42 +42 V V_Dig_IO DC Input Voltage on Pins (EN, RxD, TxD) −0.3 +7 V VESD Human Body Model (LIN Pin) (Note 1) −8 +8 kV Human Body Model (All Pins) (Note 1) −4 +4 kV Charged Device Model (All Pins) (Note 2) −750 +750 V Machine Model (All Pins) (Note 3) −200 +200 V VESDIEC Electrostatic Discharge Voltage (LIN Pin) System Human Body −8 +8 kV Model (Note 4) Conform to IEC 61000−4−2 TJ Junction Temperature Range −40 +150 °C TSTG Storage Temperature Range −55 +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Standardized human body model electrostatic discharge (ESD) pulses in accordance to EIA−JESD22. Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor. 2. Standardized charged device model ESD pulses when tested according to AEC−Q100−011. 3. In accordance to JEDEC JESD22−A115. Equivalent to discharging a 200 pF capacitor through a 10 W resistor and 0.75 mH coil. 4. Equivalent to discharging a 150 pF capacitor through a 330 W resistor. System HBM levels are verified by an external test−house.
Table 3. THERMAL CHARACTERISTICS Parameter Symbol Value Unit
Thermal characteristics, SOIC−8 (Note 5) Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6) RqJA 131 °C/W Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7) RqJA 81 °C/W Thermal characteristics, DFN8 (Note 5) Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6) RqJA 125 °C/W Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7) RqJA 58 °C/W 5. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. 6. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage. 7. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage.
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NCV7329 Table 2. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit
VBB Voltage on Pin VBB −0.3 +42 V VLIN LIN Bus Voltage with respect to GND −42 +42 V LIN Bus Voltage with respect to VBB −42 +42 V V_Dig_IO DC Input Voltage on Pins (EN, RxD, TxD) −0.3 +7 V VESD Human Body Model (LIN Pin) (Note 1) −8 +8 kV Human Body Model (All Pins) (Note 1) −4 +4 kV Charged Device Model (All Pins) (Note 2) −750 +750 V Machine Model (All Pins) (Note 3) −200 +200 V VESDIEC Electrostatic Discharge Voltage (LIN Pin) System Human Body −8 +8 kV Model (Note 4) Conform to IEC 61000−4−2 TJ Junction Temperature Range −40 +150 °C TSTG Storage Temperature Range −55 +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Standardized human body model electrostatic discharge (ESD) pulses in accordance to EIA−JESD22. Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor. 2. Standardized charged device model ESD pulses when tested according to AEC−Q100−011. 3. In accordance to JEDEC JESD22−A115. Equivalent to discharging a 200 pF capacitor through a 10 W resistor and 0.75 mH coil. 4. Equivalent to discharging a 150 pF capacitor through a 330 W resistor. System HBM levels are verified by an external test−house.
Table 3. THERMAL CHARACTERISTICS Parameter Symbol Value Unit
Thermal characteristics, SOIC−8 (Note 5) Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6) RqJA 131 °C/W Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7) RqJA 81 °C/W Thermal characteristics, DFN8 (Note 5) Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 6) RqJA 125 °C/W Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 7) RqJA 58 °C/W 5. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. 6. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage. 7. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage.
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