Datasheet CMS03 (Toshiba) - 2

CMS03
Marking
Abbreviation Code Part No. S3 CMS03
Land pattern dimensions for reference only
Unit: mm 1 2. 1.4 3.0 1.4
Handling Precaution
1) Schottky barrier diodes (SBDs) have reverse current greater than other types of diodes. This makes SBDs more vulnerable to damage due to thermal runaway under high-temperature and high-voltage conditions. Thus, both forward and reverse power losses of SBDs should be considered for thermal and safety design. 2) The absolute maximum ratings are rated values that must not be exceeded during operation, even for an instant. The following are the recommended general derating methods for designing a circuit board using this device. VRRM : Use this rating with reference to 1) above. VRRM has a temperature coefficient of 0.1%/℃ at low temperatures. Take this coefficient into account when designing a circuit board that wil be operated in a low-temperature environment. IF(AV) : We recommend that the worst-case current be no greater than 80% of the absolute maximum rating of IF(AV) and that the worst-case junction temperature, Tj, be kept below 120℃. When using this device, allow margins, referring to the Ta(max)-IF(AV) curve. IFSM : This rating specifies peak non-repetitive forward surge current. This only applies to an abnormal operation, which seldom occurs during the lifespan of a device. Tj : Derate device parameters in proportion to this rating in order to ensure high reliability. We recommend that the junction temperature (Tj) of a device be kept below 120℃. 3) Thermal resistance (junction-to-ambient) varies with the mounting conditions of a device on a circuit board. An appropriate thermal resistance value should be used, considering the heatsink, circuit board design and land pattern dimensions (provided for reference only). 4) For other design considerations, see the Rectifiers databook or the Toshiba website. 2 2018-04-04