Datasheet CMS03 (Toshiba) - 4

CMS03 IR – Tj (typ.) PR (AV) – VR (typ.) 100 2 Pulse test Rectangular DC 1.8 VR = 30 V waveform ion 360° ) 10 1.6 0° ssipat 1.4 (mA di ) VR VR = 20 V 1 er 1.2 α 300° I R VR = 15 V pow (W ) Conduction angle: α rent 1 240° T V j = 150°C R = 10 V se (AV cur 0.1 er R 0.8 VR = 5 V rev P 180° erse VR = 3 V 0.6 ev age R 0.01 0.4 120° Aver 0.2 60° 0.001 0 0 20 40 60 80 100 120 140 160 0 10 20 30 Junction temperature Tj (°C) Reverse voltage VR (V) rth (j-a) – t ) 500 /W Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm (°C Soldering land: 2.1 mm × 1.4 mm 100 board thickness: 1.6 mm e r th (j-a) Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm istanc Soldering land: 6 mm × 6 mm 10 board thickness: 1.6 mm res al rm Device mounted on a ceramic board: the board size: 50 mm × 50 mm Soldering land: 2 mm × 2 mm ient board thickness: 0.64 mm 1 Trans 0.5 0.001 0.01 0.1 1 10 100 1000 Time t (s) 4 2018-04-04