Datasheet MOC3060, MOC3061, MOC3062, MOC3063 (Isocom) - 10

MOC306x IR REFLOW SOLDERING TEMPERATURE PROFILE One Time Reflow Soldering is Recommended. Do not immerse device body in solder paste. 260°C T P T P - 5°C tP Max Ramp Up Rate Max Ramp Down Rate 3°C/s 6°C/s 217°C TL T L T 200°C smax TEMP (°C) T 150°C smin t s Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat
- Min Temperature (TSMIN) 150°C - Max Temperature (TSMAX) 200°C - Time TSMIN to TSMAX (ts) 60s - 120s
Soldering Zone
- Peak Temperature (TP) 260°C - Time at Peak Temperature 10s max - Liquidous Temperature (TL) 217°C - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) 30s max - Time maintained above TL (tL) 60s - 100s - Ramp Up Rate (TL to TP) 3°C/s max - Ramp Down Rate (TP to TL) 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 10 05/02/2018 DD93230