Datasheet MC10EP16, MC100EP16 (ON Semiconductor) - 9
| Hersteller | ON Semiconductor |
| Beschreibung | 3.3 V/5 V ECL Differential Receiver/Driver |
| Seiten / Seite | 13 / 9 — PACKAGE DIMENSIONS. DFN8 2x2, 0.5P. SCALE 4:1. PIN ONE. DETAIL A. … |
| Dateiformat / Größe | PDF / 357 Kb |
| Dokumentensprache | Englisch |
PACKAGE DIMENSIONS. DFN8 2x2, 0.5P. SCALE 4:1. PIN ONE. DETAIL A. REFERENCE. OPTIONAL. CONSTRUCTIONS. MILLIMETERS. DIM. MIN. MAX. TOP VIEW
Modelllinie für dieses Datenblatt
Textversion des Dokuments
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS DFN8 2x2, 0.5P
CASE 506AA ISSUE F 1 DATE 04 MAY 2016
SCALE 4:1
NOTES:
D A L L
1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED
L1
TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP.
PIN ONE DETAIL A
4. COPLANARITY APPLIES TO THE EXPOSED
REFERENCE E OPTIONAL
PAD AS WELL AS THE TERMINALS. ÇÇ
CONSTRUCTIONS MILLIMETERS 2X
0.10 C ÇÇ
DIM MIN MAX A
0.80 1.00
A3
ÇÇ
A1
0.00 0.05
2X
0.10 C
TOP VIEW EXPOSED Cu MOLD CMPD A3
0.20 REF ÉÉ ÉÉ
b
0.20 0.30
D
2.00 BSC ÉÉ ÇÇ ÉÉ ÇÇ
D2
1.10 1.30
DETAIL B A E
2.00 BSC 0.10 C
A1
ÇÇ
E2
0.70 0.90
e
0.50 BSC
DETAIL B K
0.30 REF
ALTERNATE L
0.25 0.35 0.08 C
CONSTRUCTIONS (A3) L1
−−− 0.10
NOTE 4 A1 SEATING SIDE VIEW C PLANE RECOMMENDED SOLDERING FOOTPRINT* DETAIL A
8X
D2 8X
1.30
L
0.50 PACKAGE 1 4 OUTLINE
E2
0.90 2.30
K
8 5
8X b
1
e/2
0.10 C A B 8X
e
0.50 0.05 C
NOTE 3
0.30 PITCH
BOTTOM VIEW
DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and
GENERIC
Mounting Techniques Reference Manual, SOLDERRM/D.
MARKING DIAGRAM*
1 XXMG G XX = Specific Device Code M = Date Code G = Pb−Free Device *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
DOCUMENT NUMBER: 98AON18658D
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: DFN8, 2.0X2.0, 0.5MM PITCH PAGE 1 OF 1 onsemi
and are trademarks of Semiconductor Components Industries, LLC dba
onsemi
or its subsidiaries in the United States and/or other countries.
onsemi
reserves the right to make changes without further notice to any products herein.
onsemi
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
onsemi
does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2016 www.onsemi.com
PACKAGE DIMENSIONS DFN8 2x2, 0.5P
CASE 506AA ISSUE F 1 DATE 04 MAY 2016
SCALE 4:1
NOTES:
D A L L
1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED
L1
TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP.
PIN ONE DETAIL A
4. COPLANARITY APPLIES TO THE EXPOSED
REFERENCE E OPTIONAL
PAD AS WELL AS THE TERMINALS. ÇÇ
CONSTRUCTIONS MILLIMETERS 2X
0.10 C ÇÇ
DIM MIN MAX A
0.80 1.00
A3
ÇÇ
A1
0.00 0.05
2X
0.10 C
TOP VIEW EXPOSED Cu MOLD CMPD A3
0.20 REF ÉÉ ÉÉ
b
0.20 0.30
D
2.00 BSC ÉÉ ÇÇ ÉÉ ÇÇ
D2
1.10 1.30
DETAIL B A E
2.00 BSC 0.10 C
A1
ÇÇ
E2
0.70 0.90
e
0.50 BSC
DETAIL B K
0.30 REF
ALTERNATE L
0.25 0.35 0.08 C
CONSTRUCTIONS (A3) L1
−−− 0.10
NOTE 4 A1 SEATING SIDE VIEW C PLANE RECOMMENDED SOLDERING FOOTPRINT* DETAIL A
8X
D2 8X
1.30
L
0.50 PACKAGE 1 4 OUTLINE
E2
0.90 2.30
K
8 5
8X b
1
e/2
0.10 C A B 8X
e
0.50 0.05 C
NOTE 3
0.30 PITCH
BOTTOM VIEW
DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and
GENERIC
Mounting Techniques Reference Manual, SOLDERRM/D.
MARKING DIAGRAM*
1 XXMG G XX = Specific Device Code M = Date Code G = Pb−Free Device *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
DOCUMENT NUMBER: 98AON18658D
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: DFN8, 2.0X2.0, 0.5MM PITCH PAGE 1 OF 1 onsemi
and are trademarks of Semiconductor Components Industries, LLC dba
onsemi
or its subsidiaries in the United States and/or other countries.
onsemi
reserves the right to make changes without further notice to any products herein.
onsemi
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
onsemi
does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2016 www.onsemi.com