SPSB081 Datasheet Automotive power management IC with LIN and CAN-FD Features • AEC-Q100 qualified • One 5 V (or 3.3 V for SPSB0813 and SPSB081C3) low drop voltage regulator (V1) for microcontroller and peripheral supply • One configurable 5 V or 3.3 V, selectable via SPI, low drop voltage regulator V2 tracker for V1 and with off-board protection • Minimum current limitation of 450 mA for V1 and 400 mA for V2 QFN32L Epad • No electrolytic capacitor required on regulator outputs (5.0x5.0x1.0 mm) • Very low quiescent current in standby modes (typ. 15 µA) • Programmable reset generator for power-on and undervoltage • Configurable window watchdog • LIN transceivers ISO 17987-4/2016 compliant (only for SPSB0815 and SPSB0813) • CAN-FD transceiver (ISO 11898-2/2016, SAE J2284 compliant) with local failure and bus failure diagnosis • Complete 2-channel contact monitoring interface (WU1 and WU2 input pins) with programmable cyclic sense functionality. WU2 also with DIR functionality • Programmable periodic system wake-up feature • STM standard serial peripheral interface (32Bit/ST-SPI) • 4 HS drivers for 0.14 A (RON = 7 Ω) suitable to drive external LED modules with high input capacitance value or to also supply external contacts Product status link • Internal 10-bit PWM timer for each standalone high-side driver SPSB081 • Buffered supply for all voltage regulators • DIAGN output pin for fail-safe signalization Product summary • Current monitor output for all internal high-side drivers Order codePackagePacking • Open-load diagnosis for all outputs SPSB0815-TR • Overcurrent protection for all outputs QFN32L SPSB0813-TR • V1 overvoltage detection and protection Epad Tape and reel • Device contains temperature warning and protection SPSB081C5-TR 5.0x50.x1.0 mm • Thermal cluster SPSB081C3-TR • Limited documentation available for customers that need support when dealing with ASIL requirements as per ISO 26262 Applications • Body control modules (BCM) • Gateway applications • Telematic control unit • Passive keyless entry and start modules • Control panel • Heating, ventilation and air conditioning (HVAC) • Seat control modules • Sunroof modules DS14048 - Rev 3 - February 2023 www.st.com For further information contact your local STMicroelectronics sales office. Document Outline Device summary Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Maximum ratings 2.1 Operating range 2.1.1 Supply voltage ranges 2.2 Absolute maximum ratings 2.3 Temperature ranges and thermal data 3 Functional description 3.1 Supply VS and VSREG 3.2 Voltage regulators 3.2.1 Voltage regulator: V1 3.2.2 Voltage regulator: V2 3.2.3 Voltage regulator failure 3.2.4 Short to ground detection 3.2.5 Voltage regulator behavior 3.3 Operating modes 3.3.1 Active mode 3.3.2 SW-debug mode 3.3.3 V1_standby mode 3.3.4 Interrupt 3.3.5 VBAT_standby mode 3.4 Wake-up from standby modes 3.4.1 Wake-up inputs 3.5 Functional overview (truth table) 3.6 Configurable window watchdog 3.6.1 Change watchdog timing 3.7 Fail safe mode 3.7.1 Temporary failures 3.7.2 Non recoverable failures - Forced in VBAT_standby mode 3.8 Reset output (NRESET) 3.9 DIAGN output 3.10 V1 overvoltage detection 3.11 LIN bus interfaces (only for SPSB0815 and SPSB0813) 3.11.1 Features 3.11.2 Error handling 3.11.2.1 Dominant TXD_L time out 3.11.2.2 Permanent recessive 3.11.2.3 Permanent dominant 3.11.3 Wake-up from standby modes 3.11.3.1 Pattern wake-up (default) 3.11.3.2 Status change wake-up - Recessive-to-dominant 3.11.3.3 Status change wake-up - Dominant-to-recessive 3.12 CAN FD bus transceiver 3.12.1 Features 3.12.2 CAN transceiver supply 3.12.3 CAN transceiver operating modes 3.12.4 CAN error handling 3.12.4.1 Dominant TXDC time out 3.12.4.2 CAN bus permanent recessive 3.12.4.3 CAN Permanent dominant 3.12.4.4 RXDC permanent recessive 3.12.5 Wake-up by CAN 3.12.6 CAN receive only mode 3.12.7 CAN looping mode 3.13 Power supply fail 3.13.1 VS supply failure 3.13.2 VSREG supply failure 3.14 Thermal state machine 3.15 Power outputs OUT1..4 3.16 Open-load detection 3.17 Overcurrent detection 3.18 Current monitor 3.19 Constant current mode 3.20 Temperature warning and shutdown 3.21 Thermal clusters 3.22 Functional safety management 4 Serial peripheral interface (SPI) 4.1 ST-SPI 4.1.1 Physical layer 4.2 Signal description 4.2.1 Clock and data characteristics 4.2.2 Communication protocol 4.2.2.1 SDI frame 4.2.2.2 Operating code 4.2.2.3 Advanced operation codes 4.2.2.4 Data-in payload 4.2.2.5 SDO frame 4.2.2.6 Global status byte (GSB) 4.2.2.7 Data-out payload 4.3 Address definition 4.3.1 Information registers 4.3.1.1 Device identification registers 4.3.1.2 SPI modes 4.3.1.3 SPI burst read 4.3.1.4 SPI data length 4.3.2 Device application registers (RAM) 4.4 Protocol failure detection 4.4.1 Clock monitor 4.4.2 SCK polarity (CPOL) check 4.4.3 SCK phase (CPHA) check 4.4.4 CSN timeout 4.4.5 SDI stuck at GND 4.4.6 SDI stuck at HIGH 4.4.7 SDO stuck at GND and HIGH 5 Electrical characteristics 5.1 Oscillator 5.2 Power-on reset (VSREG) 5.3 Voltage regulator V1 5.4 Voltage regulator V2 5.5 Reset output 5.6 DIAGN output 5.7 Watchdog 5.8 Current monitor output (CM) 5.9 Outputs OUT1..OUT4 5.10 Power outputs switching times 5.11 Output current threshold 5.12 Wake-up inputs (WU1, DIR/WU2) 5.13 CAN FD transceiver 5.14 LIN transceiver (only for SPSB0815 and SPSB0813) 5.15 SPI 5.16 Debug input 5.17 Interrupt output 5.18 Timer1 and Timer2 5.19 SGND loss comparator 6 Application 7 SPI registers 7.1 Global status byte (GSB) 7.2 Control registers overview 7.3 Status register overview 7.4 Control registers 7.5 Status registers 8 Package information 8.1 QFN32L Epad (5.0x5.0x1.0 mm) package information Revision history