Datasheet EFM8SB2 (Silicon Labs) - 9

EFM8SB2 Data Sheet System Overview
External Memory Interface (EMIF0)
The External Memory Interface (EMIF) enables access of off-chip memories and memory-mapped devices connected to the GPIO ports. The external memory space may be accessed using the external move instruction (MOVX) with the target address specified in either 8-bit or 16-bit formats. • Supports multiplexed memory access. • Four external memory modes: • Internal only. • Split mode without bank select. • Split mode with bank select. • External only • Configurable ALE (address latch enable) timing. • Configurable address setup and hold times. • Configurable write and read pulse widths.
16/32-bit CRC (CRC0)
The cyclic redundancy check (CRC) module performs a CRC using a 16-bit or 32-bit polynomial. CRC0 accepts a stream of 8-bit data and posts the result to an internal register. In addition to using the CRC block for data manipulation, hardware can automatically CRC the flash contents of the device. The CRC module is designed to provide hardware calculations for flash memory verification and communications protocols. The CRC module includes the following features: • Support for CCITT-16 polynomial (0x1021). • Support for CRC-32 polynomial (0x04C11DB7). • Byte-level bit reversal. • Automatic CRC of flash contents on one or more 1024-byte blocks. • Initial seed selection of 0x0000/0x00000000 or 0xFFFF/0xFFFFFFFF.
3.7 Analog Programmable Current Reference (IREF0)
The programmable current reference (IREF0) module enables current source or sink with two output current settings: Low Power Mode and High Current Mode. The maximum current output in Low Power Mode is 63 µA (1 µA steps) and the maximum current output in High Current Mode is 504 µA (8 µA steps). The IREF module includes the following features: • Capable of sourcing or sinking current in programmable steps. • Two operational modes: Low Power Mode and High Current Mode.
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| Smart. Connected. Energy-friendly. Rev. 1.2 | 8 Document Outline 1. Feature List 2. Ordering Information 3. System Overview 3.1 Introduction 3.2 Power 3.3 I/O 3.4 Clocking 3.5 Counters/Timers and PWM 3.6 Communications and Other Digital Peripherals 3.7 Analog 3.8 Reset Sources 3.9 Debugging 3.10 Bootloader 4. Electrical Specifications 4.1 Electrical Characteristics 4.1.1 Recommended Operating Conditions 4.1.2 Power Consumption 4.1.3 Reset and Supply Monitor 4.1.4 Flash Memory 4.1.5 Power Management Timing 4.1.6 Internal Oscillators 4.1.7 Crystal Oscillator 4.1.8 External Clock Input 4.1.9 ADC 4.1.10 Voltage References 4.1.11 Temperature Sensor 4.1.12 Comparators 4.1.13 Programmable Current Reference (IREF0) 4.1.14 Port I/O 4.2 Thermal Conditions 4.3 Absolute Maximum Ratings 4.4 Typical Performance Curves 5. Typical Connection Diagrams 5.1 Power 5.2 Debug 5.3 Other Connections 6. Pin Definitions 6.1 EFM8SB2x-QFN32 Pin Definitions 6.2 EFM8SB2x-QFN24 Pin Definitions 6.3 EFM8SB2x-QFP32 Pin Definitions 7. QFN32 Package Specifications 7.1 QFN32 Package Dimensions 7.2 QFN32 PCB Land Pattern 7.3 QFN32 Package Marking 8. QFN24 Package Specifications 8.1 QFN24 Package Dimensions 8.2 QFN24 PCB Land Pattern 8.3 QFN24 Package Marking 9. QFP32 Package Specifications 9.1 QFP32 Package Dimensions 9.2 QFP32 PCB Land Pattern 9.3 QFP32 Package Marking 10. Revision History 10.1 Revision 1.2 10.2 Revision 1.1 Table of Contents