ADG786/ADG788ABSOLUTE MAXIMUM RATINGS1 Storage Temperature Range . –65°C to +150°C (TA = 25°C unless otherwise noted) Junction Temperature . 150°C V 20 Lead CSP, θ DD to VSS . 7 V JA Thermal Impedance . 32°C/W V Lead Temperature, Soldering (10 sec) . 300°C DD to GND . –0.3 V to +7 V V IR Reflow, Peak Temperature . 220°C SS to GND . +0.3 V to –3.5 V Analog Inputs2 . VSS – 0.3 V to VDD + 0.3 V or NOTES 30 mA, Whichever Occurs First 1Stresses above those listed under Absolute Maximum Ratings may cause perma- Digital Inputs2 . –0.3 V to V nent damage to the device. This is a stress rating only; functional operation of the DD + 0.3 V or device at these or any other conditions above those listed in the operational 30 mA, Whichever Occurs First sections of this specification is not implied. Exposure to absolute maximum rating Peak Current, S or D . 100 mA conditions for extended periods may affect device reliability. Only one absolute (Pulsed at 1 ms, 10% Duty Cycle max) maximum rating may be applied at any one time. Continuous Current, S or D . 30 mA 2Overvoltages at A, EN, IN, S, or D will be clamped by internal diodes. Current Operating Temperature Range should be limited to the maximum ratings given. Industrial (A, B Versions) . –40°C to +85°C CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although WARNING! the ADG786/ADG788 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ESD SENSITIVE DEVICEPIN CONFIGURATIONSDDS2BNCNCNCVS1AIN1IN4S4AD420 19 18 17 1620 19 18 17 16PIN 1PIN 1S2AIDENTIFIER115 D2D1IDENTIFIER115 S4BS3B214 NCS1B214 VDDADG786ADG788D3313 D1V313 S3BTOP VIEWSSTOP VIEWS3A(Not to Scale)412 S1BGND(Not to Scale)412 D3EN 511 S1AS2B511 S3A678910678910SSVA2A1A0D2GNDS2AIN2IN3NCNC = NO CONNECTEXPOSED PAD TIED TO SUBSTRATE, VSS REV.$ –5–