ADG786/ADG788VDDVSSVDDVSS3VLOGICADG786/INPUT (VADG788IN)0VRSSDVOUTCEN*LVS1nFVOUTVGNDVINOUTQINJ = CLVOUT* IN1–4 for ADG734 Test Circuit 7. Charge Injection VDDVSSVDDVSS0.1F0.1F0.1F0.1FNETWORKNETWORKVVANALYZERVDDVSSANALYZERDDSSS50S50IN50INVSVSDDVOUTVVOUTINRVLINRL5050GNDGNDVOUTVOUT WITH SWITCHOFF ISOLATION = 20 LOGINSERTION LOSS = 20 LOGVSVOUT WITHOUT SWITCH Test Circuit 8. OFF Isolation Test Circuit 10. Bandwidth VDDVSSPower Supply Sequencing0.1F0.1F When using CMOS devices, care must be taken to ensure cor- rect power supply sequencing. Incorrect sequencing can result NETWORKANALYZERV in the device being subjected to stresses beyond those maximum DDVSSVOUT ratings listed in the data sheet. Digital and analog inputs should SARL be applied to the device after supplies and ground. In dual sup- 50SBDR ply applications, if digital and analog inputs may be applied 5050 prior to VDD and VSS supplies, the addition of a Schottky diode INV connected between V S SS and GND will ensure that the device GND powers on correctly. For single supply applications, VSS should be tied to GND as close to the device as possible. CHANNEL-TO-CHANNELVOUTCROSSTALK = 20 LOGVS Test Circuit 9. Channel-to-Channel Crosstalk –10– REV.$