Datasheet ADG1519 (Analog Devices) - 5

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ADG1519 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to PCB design and operating
Parameter Rating
environment. Careful attention to PCB thermal design is required. VDD to VSS 18 V θJA is the natural convection junction-to-ambient thermal resistance VDD to GND –0.3 V to +16.5 V measured in a one cubic foot sealed enclosure, and θJC is the VSS to GND +0.3 V to −16.5 V junction-to-case thermal resistance. Analog Inputs1 VSS – 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first
Table 4. Thermal Resistance
Digital Inputs1 GND – 0.3 V to V
Package Type1 θ
DD + 0.3 V or
JA θJC Unit
30 mA, whichever occurs first CP-8-31 64.90 14.31 °C/W Peak Current, Sx or D (Pulsed at 1 ms, 10% 600 mA 1 Duty-Cycle Maximum) Thermal impedance simulated values are based on a JEDEC 2S2P thermal Continuous Current per Channel, Sx or D Data in Table 2 + 15% mA test board with four thermal vias. See JEDEC JESD-51. Temperature
ESD CAUTION
Operating Range –40°C to +125°C Storage Range –65°C to +150°C
ESD (electrostatic discharge) sensitive device
. Charged devi- Junction 150°C ces and circuit boards can discharge without detection. Although Reflow Soldering Peak, Pb Free JEDEC-J-STD-020 this product features patented or proprietary protection circuitry, Peak Temperature 260°C damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid 1 Over voltages at IN, Sx, or D are clamped by internal diodes. Limit the current performance degradation or loss of functionality. to the maximum ratings given. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability.
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Document Outline Features Applications General Description Functional Block Diagram Product Highlights Specifications Dual Supply Continuous Current Per Channel, Sx or D Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits Terminology IDD ISS VD and VS RON RFLAT ON IS Off ID Off ID and IS On VINL VINH IINL and IINH CS Off CD Off CD and CS On CIN tON EN tOFF EN tTRANSITION TD Charge Injection Off Isolation Crosstalk Bandwidth Insertion Loss THD + N THD AC PSRR Applications Information Power Amplifier Gate Drive Power Supply Rails Power Supply Recommendations Outline Dimensions Ordering Guide Evaluation Boards