Datasheet NXS0506 (Nexperia) - 8
| Hersteller | Nexperia |
| Beschreibung | SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection |
| Seiten / Seite | 17 / 8 — Nexperia. NXS0506. SD 3.0-compatible memory card integrated … |
| Revision | 31012022 |
| Dateiformat / Größe | PDF / 269 Kb |
| Dokumentensprache | Englisch |
Nexperia. NXS0506. SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and
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Nexperia NXS0506 SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection Symbol Parameter Conditions Tamb = -40 °C to 85 °C Unit Min Typ[1] Max Current consumption
ICC supply current host side; all inputs = HIGH - - 4 µA VI = VCCA; VCCA = 1.95 V; VCCB = 3.6 V card side; all inputs = HIGH - - 7 µA VI = VCCA; VCCA = 1.7 V; VCCB = 1.7 V card side; all inputs = HIGH - - 20 µA VI = VCCA; VCCA = 1.95 V; VCCB = 3.6 V [1] Typical values are measured at Tamb = 25 °C.
13. Dynamic characteristics 13.1. Level translator Table 9. Level translator dynamic characteristics
At recommended operating conditions; For waveform and test circuit see Fig. 5 and Fig. 6.
Symbol Parameter Conditions Tamb = -40 °C to 85 °C Unit Min Typ[1] Max Host-side output transition times
tt transition time VCCA = 1.2 V to VCCA = 1.8 V [2] - 0.3 1.0 ns output transition time between VX = 0.35VCCA and VY = 0.65VCCA.
Host-side input rise and fall times
tr, tf rise and fall time VCCA = 1.2 V to 1.8 V; - 0.4 1.0 ns input rise and fall time between VX = 0.35VCCA and VY = 0.65VCCA.
Card-side output transition times
tt transition time VCCB = 1.8 V; [2] 0.4 0.88 1.32 ns output transition time between VX = 0.45 V and VY = 1.4 V
Card-side input rise and fall times
tr rise time VCCB = 1.8 V; input rise time between 0.58 V and 1.27 V 0.2 0.5 0.96 ns tf fall time VCCB = 1.8 V; input fall time between 0.58 V and 1.27 V 0.2 0.45 0.96 ns
Host-side to card-side propagation delay; DATnA to DATnB, CMDA to CMDB and CLKA to CLKB
tpd propagation VCCA = 1.2 V; VCCB = 1.8 V [3] - 3.1 5.4 ns delay VCCA = 1.2 V; VCCB = 3.3 V [3] - 2.2 4.0 ns VCCA = 1.8 V; VCCB = 1.8 V [3] - 2.7 4.8 ns VCCA = 1.8 V; VCCB = 3.3 V [3] - 1.7 3.1 ns
Card-side to host-side propagation delay; DATnB to DATnA and CMDB to CMDA
tpd propagation VCCA = 1.2 V; VCCB = 1.8 V [3] - 2.7 4.6 ns delay VCCA = 1.2 V; VCCB = 3.3 V [3] - 1.7 3.0 ns VCCA = 1.8 V; VCCB = 1.8 V [3] - 2.7 4.6 ns VCCA = 1.8 V; VCCB = 3.3 V [3] - 1.6 2.7 ns NXS0506 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 1 — 31 January 2022 8 / 17
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 5. Marking 6. Block diagram 7. Functional diagram 8. Pinning information 8.1. Pinning 8.2. Pin description 9. Functional description 9.1. Level translator 9.2. Enable and direction control 9.3. Feedback clock channel 9.4. EMI filter 9.5. ESD protection 9.6. Pin and channel naming 10. Limiting values 11. Recommended operating conditions 12. Static characteristics 13. Dynamic characteristics 13.1. Level translator 14. Application information 14.1. PCB design guidelines 15. Design and assembly recommendations 15.1. PCB design guidelines 15.2. PCB assembly guidelines for Pb-free soldering 16. Package outline 17. Abbreviations 18. Revision history 19. Legal information Contents
Nexperia NXS0506 SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection Symbol Parameter Conditions Tamb = -40 °C to 85 °C Unit Min Typ[1] Max Current consumption
ICC supply current host side; all inputs = HIGH - - 4 µA VI = VCCA; VCCA = 1.95 V; VCCB = 3.6 V card side; all inputs = HIGH - - 7 µA VI = VCCA; VCCA = 1.7 V; VCCB = 1.7 V card side; all inputs = HIGH - - 20 µA VI = VCCA; VCCA = 1.95 V; VCCB = 3.6 V [1] Typical values are measured at Tamb = 25 °C.
13. Dynamic characteristics 13.1. Level translator Table 9. Level translator dynamic characteristics
At recommended operating conditions; For waveform and test circuit see Fig. 5 and Fig. 6.
Symbol Parameter Conditions Tamb = -40 °C to 85 °C Unit Min Typ[1] Max Host-side output transition times
tt transition time VCCA = 1.2 V to VCCA = 1.8 V [2] - 0.3 1.0 ns output transition time between VX = 0.35VCCA and VY = 0.65VCCA.
Host-side input rise and fall times
tr, tf rise and fall time VCCA = 1.2 V to 1.8 V; - 0.4 1.0 ns input rise and fall time between VX = 0.35VCCA and VY = 0.65VCCA.
Card-side output transition times
tt transition time VCCB = 1.8 V; [2] 0.4 0.88 1.32 ns output transition time between VX = 0.45 V and VY = 1.4 V
Card-side input rise and fall times
tr rise time VCCB = 1.8 V; input rise time between 0.58 V and 1.27 V 0.2 0.5 0.96 ns tf fall time VCCB = 1.8 V; input fall time between 0.58 V and 1.27 V 0.2 0.45 0.96 ns
Host-side to card-side propagation delay; DATnA to DATnB, CMDA to CMDB and CLKA to CLKB
tpd propagation VCCA = 1.2 V; VCCB = 1.8 V [3] - 3.1 5.4 ns delay VCCA = 1.2 V; VCCB = 3.3 V [3] - 2.2 4.0 ns VCCA = 1.8 V; VCCB = 1.8 V [3] - 2.7 4.8 ns VCCA = 1.8 V; VCCB = 3.3 V [3] - 1.7 3.1 ns
Card-side to host-side propagation delay; DATnB to DATnA and CMDB to CMDA
tpd propagation VCCA = 1.2 V; VCCB = 1.8 V [3] - 2.7 4.6 ns delay VCCA = 1.2 V; VCCB = 3.3 V [3] - 1.7 3.0 ns VCCA = 1.8 V; VCCB = 1.8 V [3] - 2.7 4.6 ns VCCA = 1.8 V; VCCB = 3.3 V [3] - 1.6 2.7 ns NXS0506 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 1 — 31 January 2022 8 / 17
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 5. Marking 6. Block diagram 7. Functional diagram 8. Pinning information 8.1. Pinning 8.2. Pin description 9. Functional description 9.1. Level translator 9.2. Enable and direction control 9.3. Feedback clock channel 9.4. EMI filter 9.5. ESD protection 9.6. Pin and channel naming 10. Limiting values 11. Recommended operating conditions 12. Static characteristics 13. Dynamic characteristics 13.1. Level translator 14. Application information 14.1. PCB design guidelines 15. Design and assembly recommendations 15.1. PCB design guidelines 15.2. PCB assembly guidelines for Pb-free soldering 16. Package outline 17. Abbreviations 18. Revision history 19. Legal information Contents