Datasheet RAA788150, RAA788152, RAA788153, RAA788155, RAA788156, RAA788158 (Renesas) - 5
| Hersteller | Renesas |
| Beschreibung | Large 3V Output Swing, 5kV EFT, 16.5kV ESD, RS-485 Transceivers |
| Seiten / Seite | 34 / 5 — RAA788150, RAA788152, RAA788153, RAA788155, RAA788156, RAA788158 … |
| Dateiformat / Größe | PDF / 613 Kb |
| Dokumentensprache | Englisch |
RAA788150, RAA788152, RAA788153, RAA788155, RAA788156, RAA788158 Datasheet. 3. Specifications. 3.1. Absolute Maximum Ratings
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RAA788150, RAA788152, RAA788153, RAA788155, RAA788156, RAA788158 Datasheet 3. Specifications 3.1 Absolute Maximum Ratings CAUTION
: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product reliability and result in failures not covered by warranty.
Parameter[1] Minimum Maximum Unit
VCC to Ground - 7 V Input Voltages at DI, DE, RE -0.3 VCC + 0.3 V Bus I/O Voltages at A/Y, B/Z, A, B, Y, Z -9 13 V Transient Pulse Voltages through 100Ω at A/Y, B/Z, A, B, Y, Z[2] - ±100 V RO -0.3 VCC + 0.3 V Short-Circuit Duration at Y, Z Continuous EFT Rating See EFT Performance. ESD Rating See ESD Performance. 1. Absolute Maximum ratings mean the device is not damaged if operated under these conditions. It does not guarantee performance. 2. Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15µs at a 1% duty cycle).
3.2 Recommended Operating Conditions Parameter Minimum Maximum Unit
Supply Voltage 4.5 5.5 V Temperature Range -40 +85 °C Bus Pin Common-Mode Voltage Range -7 +12 V
3.3 Thermal Information Thermal Resistance (Typical) θJA (°C/W)[1]
8 Ld SOIC 105 8 Ld MSOP 140 10 Ld MSOP 130 14 Ld SOIC 130 1. θJA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details.
Parameter Minimum Maximum Unit
Maximum Junction Temperature (Plastic Package) - +150 °C Maximum Storage Temperature Range -65 +150 °C Pb-Free Reflow Profile[1] See TB493 1. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. R15DS0005EU0102 Rev.1.02 Page 5 Aug 19, 2021 Document Outline Features Applications Contents 1. Overview 1.1 Typical Operating Circuit 2. Pin Information 2.1 Pin Assignments 2.2 Pin Descriptions 3. Specifications 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Information 3.4 Electrical Specifications 4. Test Circuits and Waveforms 5. Typical Performance Curves 6. Device Description 6.1 Overview 6.2 Functional Block Diagram 6.3 Operating Modes 6.3.1 Driver Operation 6.3.2 Receiver Operation 6.4 Device Features 6.4.1 Large Output Signal Swing 6.4.2 Driver Overload Protection 6.4.3 Full-Failsafe Receiver 6.4.4 Low Current Shutdown Mode 6.4.5 Hot Plug Function 6.4.6 High EFT Immunity 6.4.7 High ESD Protection 7. Application Information 7.1 Network Design 7.1.1 Cable Type 7.1.2 Cable Length vs Data Rate 7.1.3 Topologies and Stub Lengths 7.1.4 Minimum Distance between Nodes 7.1.5 Failsafe Biasing Termination 7.2 Transient Protection 7.3 Layout Guidelines 7.3.1 Layout Example 8. Package Outline Drawings 9. Ordering Information 10. Revision History
RAA788150, RAA788152, RAA788153, RAA788155, RAA788156, RAA788158 Datasheet 3. Specifications 3.1 Absolute Maximum Ratings CAUTION
: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product reliability and result in failures not covered by warranty.
Parameter[1] Minimum Maximum Unit
VCC to Ground - 7 V Input Voltages at DI, DE, RE -0.3 VCC + 0.3 V Bus I/O Voltages at A/Y, B/Z, A, B, Y, Z -9 13 V Transient Pulse Voltages through 100Ω at A/Y, B/Z, A, B, Y, Z[2] - ±100 V RO -0.3 VCC + 0.3 V Short-Circuit Duration at Y, Z Continuous EFT Rating See EFT Performance. ESD Rating See ESD Performance. 1. Absolute Maximum ratings mean the device is not damaged if operated under these conditions. It does not guarantee performance. 2. Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15µs at a 1% duty cycle).
3.2 Recommended Operating Conditions Parameter Minimum Maximum Unit
Supply Voltage 4.5 5.5 V Temperature Range -40 +85 °C Bus Pin Common-Mode Voltage Range -7 +12 V
3.3 Thermal Information Thermal Resistance (Typical) θJA (°C/W)[1]
8 Ld SOIC 105 8 Ld MSOP 140 10 Ld MSOP 130 14 Ld SOIC 130 1. θJA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details.
Parameter Minimum Maximum Unit
Maximum Junction Temperature (Plastic Package) - +150 °C Maximum Storage Temperature Range -65 +150 °C Pb-Free Reflow Profile[1] See TB493 1. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. R15DS0005EU0102 Rev.1.02 Page 5 Aug 19, 2021 Document Outline Features Applications Contents 1. Overview 1.1 Typical Operating Circuit 2. Pin Information 2.1 Pin Assignments 2.2 Pin Descriptions 3. Specifications 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Information 3.4 Electrical Specifications 4. Test Circuits and Waveforms 5. Typical Performance Curves 6. Device Description 6.1 Overview 6.2 Functional Block Diagram 6.3 Operating Modes 6.3.1 Driver Operation 6.3.2 Receiver Operation 6.4 Device Features 6.4.1 Large Output Signal Swing 6.4.2 Driver Overload Protection 6.4.3 Full-Failsafe Receiver 6.4.4 Low Current Shutdown Mode 6.4.5 Hot Plug Function 6.4.6 High EFT Immunity 6.4.7 High ESD Protection 7. Application Information 7.1 Network Design 7.1.1 Cable Type 7.1.2 Cable Length vs Data Rate 7.1.3 Topologies and Stub Lengths 7.1.4 Minimum Distance between Nodes 7.1.5 Failsafe Biasing Termination 7.2 Transient Protection 7.3 Layout Guidelines 7.3.1 Layout Example 8. Package Outline Drawings 9. Ordering Information 10. Revision History