Datasheet ESDCAN03-2BM3Y (STMicroelectronics) - 5
| Hersteller | STMicroelectronics |
| Beschreibung | Automotive dual-line TVS in DFN for CAN bus |
| Seiten / Seite | 15 / 5 — ESDCAN03-2BM3Y. Characteristics (curves). Figure 8. Response to ISO 10605 … |
| Dateiformat / Größe | PDF / 1.4 Mb |
| Dokumentensprache | Englisch |
ESDCAN03-2BM3Y. Characteristics (curves). Figure 8. Response to ISO 10605 -C = 150 pF, R = 330 Ω
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ESDCAN03-2BM3Y Characteristics (curves) Figure 8. Response to ISO 10605 -C = 150 pF, R = 330 Ω Figure 9. Response to ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact) (+8 kV contact ) Figure 10. Response to ISO 7637-3 Pulse 3a: -150 V Figure 11. Response to ISO 7637-3 Pulse 3b : +150 V Figure 12. Response to ISO 7637-3 pulse 2a: -85 V Figure 13. Response to ISO 7637-3 pulse 2a: +85 V
Note: DCC (direct capacitive coupling) for Figure 10, Figure 11, Figure 12 and Figure 13.
DS13559
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Rev 2 page 5/15
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 QFN-3L 1.1 x 1.0 x 0.55 package information 2.2 Packing information 3 Recommendation on PCB assembly 3.1 Footprint 3.2 Stencil opening design 3.3 Wettable flank profile 3.4 Solder paste 3.5 Placement 3.6 PCB design preference 3.7 Reflow profile 4 Ordering information Revision history
ESDCAN03-2BM3Y Characteristics (curves) Figure 8. Response to ISO 10605 -C = 150 pF, R = 330 Ω Figure 9. Response to ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact) (+8 kV contact ) Figure 10. Response to ISO 7637-3 Pulse 3a: -150 V Figure 11. Response to ISO 7637-3 Pulse 3b : +150 V Figure 12. Response to ISO 7637-3 pulse 2a: -85 V Figure 13. Response to ISO 7637-3 pulse 2a: +85 V
Note: DCC (direct capacitive coupling) for Figure 10, Figure 11, Figure 12 and Figure 13.
DS13559
-
Rev 2 page 5/15
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 QFN-3L 1.1 x 1.0 x 0.55 package information 2.2 Packing information 3 Recommendation on PCB assembly 3.1 Footprint 3.2 Stencil opening design 3.3 Wettable flank profile 3.4 Solder paste 3.5 Placement 3.6 PCB design preference 3.7 Reflow profile 4 Ordering information Revision history