ESDCAN03-2BM3Y Datasheet Automotive dual-line TVS in DFN for CAN bus Features • AEC-Q101 qualified • Dual-line ESD and EOS protection • Triggering voltage, VTRIG min = 28 V • QFN-3L 1.1 x 1.0 x 0.55 package also called DFN1110 • Bidirectional device • Max pulse power up to 3.3 A (8/20 μs) • Low clamping factor VCL / VBR • Low leakage current • ECOPACK2 ROHS compliant component Complies with the following standards • UL94, V0 • J-STD-020 MSL level 1 • IPC7531 footprint and JEDEC registered package • ISO 16750-2 (Jump start and reversed battery tests) • ISO 10605 / IEC 61000-4-2- C = 150 pF, R = 330 Ω, exceeds level 4: – ±15 kV (contact and air discharge) • ISO 10605 - C = 330 pF, R = 2 kΩ: – ±30 kV (contact and air discharge) • ISO 10605 - C = 330 pF, R = 330 Ω: Product status link – ±12 kV (contact and air discharge) ESDCAN03-2BM3Y • ISO 7637-3: – Pulse 3a: -150 V Product summary – Pulse 3b: +150 V Order code ESDCAN03-2BM3Y – Pulse 2a: +/- 85 V Applications Automotive controller area network where an electrostatic discharge or another transient surge may damage the CAN transceiver or an integrated circuit (IC) featuring a CAN PHY. This product is compliant with most of automotive interfaces. Description This device is a dual-line transient voltage suppressor (TVS) specifically designed to protect the CAN H and CAN L pins of an automotive CAN transceiver against electrostatic discharge (ESD) and ISO 7637-3. The ESDCAN03-2BM3Y complies with all the physical layer constraints (jump start, reverse polarity, …) without compromising the low clamping voltage for an efficient CAN bus protection. The low line capacitance of each ESD diode makes this CAN protection compatible not only with CAN-FD but also with high speed and high data rate buses like FlexRay, USB and more. DS13559 - Rev 2 - January 2021 www.st.com For further information contact your local STMicroelectronics sales office. Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 QFN-3L 1.1 x 1.0 x 0.55 package information 2.2 Packing information 3 Recommendation on PCB assembly 3.1 Footprint 3.2 Stencil opening design 3.3 Wettable flank profile 3.4 Solder paste 3.5 Placement 3.6 PCB design preference 3.7 Reflow profile 4 Ordering information Revision history