AD8276/AD8277Data SheetPIN CONFIGURATIONS AND FUNCTION DESCRIPTIONSREF18NCREF18NC–INAD8276AD827627+VS–IN27+VSTOP VIEW+INTOP VIEW36OUT(Not to Scale)+IN36OUT(Not to Scale)–VS45SENSE–VS45SENSE 003 004 NC = NO CONNECT 07692- NC = NO CONNECT 07692- Figure 4. AD8276 8-Lead MSOP Pin Configuration Figure 5. AD8276 8-Lead SOIC Pin Configuration Table 6. AD8276 Pin Function Descriptions Pin No.MnemonicDescription 1 REF Reference Voltage Input. 2 −IN Inverting Input. 3 +IN Noninverting Input. 4 −VS Negative Supply. 5 SENSE Sense Terminal. 6 OUT Output. 7 +VS Positive Supply. 8 NC No Connect. This pin is not internally connected. +VSREF–INOUT+INSENSE–VS 106 07692- Figure 6. AD8276 7-Pad CHIP Pad Configuration Table 7. AD8276 Pad Function Descriptions1 Pad No.MnemonicX CoordinateY CoordinateDescription 1 REF −512 +412 Reference Voltage Input 2 −IN −512 +167 Inverting Input 3 +IN −512 −188 Noninverting Input 4 −VS −106 −400 Negative Supply 5 SENSE +511 −376 Sense Terminal 6 OUT +530 0 Output 7 +VS +329 +453 Positive Supply 1 All dimensions are referenced from the center of the die to the center of each bond pad. Rev. D | Page 6 of 22 Document Outline Features Applications General Description Functional Block Diagrams Table of Contents Revision History Specifications Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation Short-Circuit Current ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Circuit Information DC Performance AC Performance Driving the AD8276/AD8277 Input Voltage Range Power Supplies Applications Information Configurations Differential Output Current Source Voltage and Current Monitoring Instrumentation Amplifier RTD Die Information Die Specifications and Assembly Recommendations Outline Dimensions Ordering Guide