Datasheet AD8276, AD8277 (Analog Devices) - 5

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Data Sheet AD8276/ AD8277 ABSOLUTE MAXIMUM RATINGS 2.0 Table 4. TJ MAX = 150°C ) Parameter Rating (W 1.6
Supply Voltage ±18 V
N 14-LEAD SOIC IO T θJA = 105°C/W
Maximum Voltage at Any Input Pin −VS + 40 V
PA
Minimum Voltage at Any Input Pin +V
1.2
S − 40 V
ISSI 8-LEAD SOIC D θJA = 121°C/W
Storage Temperature Range −65°C to +150°C
ER
Specified Temperature Range −40°C to +85°C
W 0.8 8-LEAD MSOP
Package Glass Transition Temperature (T
θ
G) 150°C
M PO JA = 135°C/W MU
Stresses at or above those listed under Absolute Maximum
XI 0.4
Ratings may cause permanent damage to the product. This is a
MA
stress rating only; functional operation of the product at these
0
or any other conditions above those indicated in the operational
–50 –25 0 25 50 75 100 125
002 section of this specification is not implied. Operation beyond
AMBIENT TEMERATURE (°C)
07692- the maximum operating conditions for extended periods may Figure 3. Maximum Power Dissipation vs. Ambient Temperature affect product reliability.
SHORT-CIRCUIT CURRENT THERMAL RESISTANCE
The AD8276/AD8277 have built in, short-circuit protection Thermal performance is directly linked to printed circuit board that limits the output current (see Figure 26 for more (PCB) design and operating environment. Close attention to information). While the short-circuit condition itself does not PCB thermal design is required. damage the device, the heat generated by the condition can cause the device to exceed its maximum junction temperature, θJA is junction-to-ambient thermal resistance and θJC is with corresponding negative effects on reliability. Figure 3 and junction-to-case thermal resistance. Figure 26, combined with knowledge of the supply voltages and
Table 5.
ambient temperature of the device, can be used to determine
Package Type θ 1
whether a short circuit can cause the device to exceed its
JA θJC Unit
RM-8 135 67.8 °C/W maximum junction temperature. R-8 121 57.6 °C/W
ESD CAUTION
R-14 105 35.8 °C/W 1 The θJA values in Table 5 assume a 4-layer JEDEC standard board with zero airflow.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8276/AD8277 is limited by the associated rise in junction temperature (T J) on the die. At approximately 150°C, which is the glass transition temperature, the properties of the plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a temperature of 150°C for an extended period may result in a loss of functionality. Rev. D | Page 5 of 22 Document Outline Features Applications General Description Functional Block Diagrams Table of Contents Revision History Specifications Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation Short-Circuit Current ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Circuit Information DC Performance AC Performance Driving the AD8276/AD8277 Input Voltage Range Power Supplies Applications Information Configurations Differential Output Current Source Voltage and Current Monitoring Instrumentation Amplifier RTD Die Information Die Specifications and Assembly Recommendations Outline Dimensions Ordering Guide