Datasheet AD8479-EP (Analog Devices) - 4

AD8479-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board VS ±18 V (PCB) design and operating environment. Careful attention to Input Voltage Range PCB thermal design is required. Continuous ±600 V θJA is the natural convection, junction to ambient thermal Common-Mode and Differential, ±900 V resistance measured in a one cubic foot sealed enclosure. 10 sec Output Short-Circuit Duration Indefinite θJC is the junction to case thermal resistance. REF(−) and REF(+) −VS − 0.3 V to +VS + 0.3 V
Table 3. Thermal Resistance
Maximum Junction Temperature 150°C
Package Type θ 1 2 JA θJC Unit
Operating Temperature Range −55°C to +125°C R-8 122 87 °C/W Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test board. See JEDEC JESD-51. Stresses at or above those listed under Absolute Maximum 2 Thermal impedance simulated values are based on JEDEC 1S0P thermal test Ratings may cause permanent damage to the product. This is a board. See JEDEC JESD51. stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide