HMC8415LP6GEData Sheet50501000mA 500mA4848300mA464644444242Bm)Bm)dd(40(40UTUTOOP38P38363634341000mA3232500mA 300mA30308.59.09.510.010.511.0 020 8.59.09.510.010.511.0 023 FREQUENCY (GHz) 16688- FREQUENCY (GHz) 16688- Figure 20. POUT at PIN = 23 dBm vs. Frequency at Various Quiescent Currents Figure 23. POUT at PIN = 21 dBm vs. Frequency at Various Quiescent Currents at VDDxA/VDDxB = 28 V at VDDxA/VDDxB = 28 V 6060–40°C–40°C+25°C+25°C+85°C+85°C5050%)%)((YYNC40NCE40EICIICIFFFF3030D ED EADDE20ADDE20ERERWWPO10PO10008.59.09.510.010.511.0 021 8.59.09.510.010.511.0 024 FREQUENCY (GHz) 16688- FREQUENCY (GHz) 16688- Figure 21. Power Added Efficiency at PIN = 23 dBm vs. Frequency at Various Figure 24. Power Added Efficiency at PIN = 21 dBm vs. Frequency at Various Temperatures Temperatures 505024V24V28V4528V32V4532V40%)40(%)Y( Y35NC35ENC EICI30ICI30F FF F25D E25D E2020ADDEADDE15ER15ERWW10PO10PO55008.59.09.510.010.511.0 022 8.59.09.510.010.511.0 025 FREQUENCY (GHz) 16688- FREQUENCY (GHz) 16688- Figure 22. Power Added Efficiency at PIN = 23 dBm vs. Frequency at Various Figure 25. Power Added Efficiency at PIN = 21 dBm vs. Frequency at Various Supply Voltages at IDQ = 1000 mA Supply Voltages at IDQ = 1000 mA Rev. A | Page 10 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS TOTAL TARGET QUIESCENT CURRENT BY VDDxA/VDDxB ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT AND PULSOR CIRCUIT USING THE EV1HMC8415LP6G WITH THE DRAIN BIAS PULS0R BOARD RECOMMENDED BIAS SEQUENCE Power-Up Bias Concept for the EV1HMC8415LP6G with the Pulsor Power-Down Bias Concept for the EV1HMC8415LP6G with the Pulsor MAKING AVERAGE TO PULSED APPROXIMATIONS EVALUATION PCB BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE