Datasheet HMC-ALH369 (Analog Devices) - 3
| Hersteller | Analog Devices |
| Beschreibung | GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz |
| Seiten / Seite | 6 / 3 — HMC-ALH369. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 24 - 40 GHz. Absolute … |
| Dateiformat / Größe | PDF / 495 Kb |
| Dokumentensprache | Englisch |
HMC-ALH369. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 24 - 40 GHz. Absolute Maximum Ratings. Outline Drawing
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HMC-ALH369
v06.0118
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz Absolute Maximum Ratings
Drain Bias Voltage +5.5 Vdc IP RF Input Power (24 - 32 GHz) 5 dBm ELECTROSTATIC SENSITIVE DEVICE H RF Input Power (32 - 40 GHz) -1 dBm OBSERVE HANDLING PRECAUTIONS Channel Temperature 180 °C C - Storage Temperature -65 to +150 °C S Operating Temperature -55 to +85 °C R IE LIF P M
Outline Drawing
A E IS O N W LO NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. Standard Alternate 3. BACKSIDE METALLIZATION: GOLD. GP-2 (Gel Pack) [2] 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. [1] Refer to the “Packaging Information” section for die packaging dimensions. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Analog 7. OVERALL DIE SIZE ±.002” Devices Corporation. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
3
Application Support: Phone: 1-800-ANALOG-D
v06.0118
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz Absolute Maximum Ratings
Drain Bias Voltage +5.5 Vdc IP RF Input Power (24 - 32 GHz) 5 dBm ELECTROSTATIC SENSITIVE DEVICE H RF Input Power (32 - 40 GHz) -1 dBm OBSERVE HANDLING PRECAUTIONS Channel Temperature 180 °C C - Storage Temperature -65 to +150 °C S Operating Temperature -55 to +85 °C R IE LIF P M
Outline Drawing
A E IS O N W LO NOTES:
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. Standard Alternate 3. BACKSIDE METALLIZATION: GOLD. GP-2 (Gel Pack) [2] 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. [1] Refer to the “Packaging Information” section for die packaging dimensions. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Analog 7. OVERALL DIE SIZE ±.002” Devices Corporation. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
3
Application Support: Phone: 1-800-ANALOG-D