Datasheet NC7SZ04 (ON Semiconductor) - 3

NC7SZ04 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit
VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V VOUT DC Output Voltage −0.5 6.5 V IIK DC Input Diode Current VIN < 0 V − −50 mA IOK DC Output Diode Current VOUT < 0 V − −50 mA IOUT DC Output Current − ±50 mA ICC or IGND DC VCC or Ground Current − ±50 mA TSTG Storage Temperature Range −65 +150 °C TJ Junction Temperature Under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air SC−74A − 390 mW SC−88A − 332 MicroPak−6 − 812 MicroPak2™−6 − 812 ESD Human Body Model, JEDEC: JESD22−A114 − 4000 V Charge Device Model, JEDEC: JESD22−C101 − 2000 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage Operating 1.65 5.5 V Supply Voltage Data Retention 1.5 5.5 VIN Input Voltage 0 5.5 V VOUT Output Voltage 0 VCC V TA Operating Temperature −40 +85 °C tr, tf Input Rise and Fall Times VCC at 1.8 V, 2.5 V ±0.2 V 0 20 ns/V VCC at 3.3 V ±0.3 V 0 10 VCC at 5.0 V ±0.5 V 0 5 qJA Thermal Resistance SC−74A − 320 °C/W SC−88A − 377 MicroPak−6 − 154 MicroPak2−6 − 154 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float.
www.onsemi.com 3