Datasheet MBRS540, NRVBS540T3G (ON Semiconductor) - 5
| Hersteller | ON Semiconductor |
| Beschreibung | Surface Mount Schottky Power Rectifier |
| Seiten / Seite | 7 / 5 — PACKAGE DIMENSIONS. SMC. SCALE 1:1. MILLIMETERS. INCHES. DIM. MIN. NOM. … |
| Revision | 10 |
| Dateiformat / Größe | PDF / 249 Kb |
| Dokumentensprache | Englisch |
PACKAGE DIMENSIONS. SMC. SCALE 1:1. MILLIMETERS. INCHES. DIM. MIN. NOM. MAX. GENERIC. MARKING DIAGRAM*. SOLDERING FOOTPRINT*
Modelllinie für dieses Datenblatt
Textversion des Dokuments
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SMC
CASE 403−03 ISSUE F DATE 02 JUN 2017
SCALE 1:1
NOTES:
HE
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
E
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A
1.90 2.13 2.41 0.075 0.084 0.095
b D A1
0.05 0.10 0.15 0.002 0.004 0.006
b
2.92 3.00 3.07 0.115 0.118 0.121
c
0.15 0.23 0.30 0.006 0.009 0.012
D
5.59 5.84 6.10 0.220 0.230 0.240
E
6.60 6.86 7.11 0.260 0.270 0.280
HE
7.75 7.94 8.13 0.305 0.313 0.320
L
0.76 1.02 1.27 0.030 0.040 0.050
L1
0.51 REF 0.020 REF
A GENERIC MARKING DIAGRAM* c L L1 A1
AYWW AYWW XXXXG XXXXXG
SOLDERING FOOTPRINT*
G G 4.343 XXXXX = Specific Device Code 0.171 A = Assembly Location Y = Year WW = Work Week 3.810 G = Pb−Free Package 0.150 (Note: Microdot may be in either location) *This information is generic. Please refer to 2.794 device data sheet for actual part marking. 0.110 Pb−Free indicator, “G” or microdot “ G”, SCALE 4:1 ǒ mm Ǔ may or may not be present. Some products inches may not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ASB42668B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SMC PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS SMC
CASE 403−03 ISSUE F DATE 02 JUN 2017
SCALE 1:1
NOTES:
HE
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
E
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A
1.90 2.13 2.41 0.075 0.084 0.095
b D A1
0.05 0.10 0.15 0.002 0.004 0.006
b
2.92 3.00 3.07 0.115 0.118 0.121
c
0.15 0.23 0.30 0.006 0.009 0.012
D
5.59 5.84 6.10 0.220 0.230 0.240
E
6.60 6.86 7.11 0.260 0.270 0.280
HE
7.75 7.94 8.13 0.305 0.313 0.320
L
0.76 1.02 1.27 0.030 0.040 0.050
L1
0.51 REF 0.020 REF
A GENERIC MARKING DIAGRAM* c L L1 A1
AYWW AYWW XXXXG XXXXXG
SOLDERING FOOTPRINT*
G G 4.343 XXXXX = Specific Device Code 0.171 A = Assembly Location Y = Year WW = Work Week 3.810 G = Pb−Free Package 0.150 (Note: Microdot may be in either location) *This information is generic. Please refer to 2.794 device data sheet for actual part marking. 0.110 Pb−Free indicator, “G” or microdot “ G”, SCALE 4:1 ǒ mm Ǔ may or may not be present. Some products inches may not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ASB42668B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SMC PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com