Datasheet MBRS540, NRVBS540T3G (ON Semiconductor) - 6
| Hersteller | ON Semiconductor |
| Beschreibung | Surface Mount Schottky Power Rectifier |
| Seiten / Seite | 7 / 6 — PACKAGE DIMENSIONS. SMC 2−LEAD. SCALE 1:1. MILLIMETERS. INCHES. DIM. MIN. … |
| Revision | 10 |
| Dateiformat / Größe | PDF / 249 Kb |
| Dokumentensprache | Englisch |
PACKAGE DIMENSIONS. SMC 2−LEAD. SCALE 1:1. MILLIMETERS. INCHES. DIM. MIN. MAX. DETAIL A. TOP VIEW. GENERIC. MARKING DIAGRAM*. SIDE VIEW. END VIEW
Modelllinie für dieses Datenblatt
Textversion des Dokuments
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SMC 2−LEAD
CASE 403AC ISSUE B DATE 27 JUL 2017
SCALE 1:1
NOTES:
HE
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES.
E
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA DETERMINED BY DIMENSION L.
MILLIMETERS INCHES D DIM MIN MAX MIN MAX A
1.95 2.61 0.077 0.103
A1 c A1
0.05 0.20 0.002 0.008
DETAIL A A2
1.90 2.41 0.075 0.095
b
2.90 3.20 0.114 0.126
TOP VIEW c
0.15 0.41 0.006 0.016
D
5.55 6.25 0.219 0.246
DETAIL A E
6.60 7.15 0.260 0.281
HE
7.75 8.15 0.305 0.321
A2 A L
0.75 1.60 0.030 0.063
GENERIC L b MARKING DIAGRAM* SIDE VIEW END VIEW
AYWW
RECOMMENDED
XXXXG
SOLDERING FOOTPRINT*
G 8.750 0.344 XXXX = Specific Device Code A = Assembly Location Y = Year 3.790 WW = Work Week 2X 0.149 G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to 2.250 2X ǒ mm Ǔ SCALE 4:1 device data sheet for actual part marking. 0.089 inches Pb−Free indicator, “G” or microdot “ G”, may or may not be present. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON97675F
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SMC 2−LEAD PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS SMC 2−LEAD
CASE 403AC ISSUE B DATE 27 JUL 2017
SCALE 1:1
NOTES:
HE
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES.
E
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA DETERMINED BY DIMENSION L.
MILLIMETERS INCHES D DIM MIN MAX MIN MAX A
1.95 2.61 0.077 0.103
A1 c A1
0.05 0.20 0.002 0.008
DETAIL A A2
1.90 2.41 0.075 0.095
b
2.90 3.20 0.114 0.126
TOP VIEW c
0.15 0.41 0.006 0.016
D
5.55 6.25 0.219 0.246
DETAIL A E
6.60 7.15 0.260 0.281
HE
7.75 8.15 0.305 0.321
A2 A L
0.75 1.60 0.030 0.063
GENERIC L b MARKING DIAGRAM* SIDE VIEW END VIEW
AYWW
RECOMMENDED
XXXXG
SOLDERING FOOTPRINT*
G 8.750 0.344 XXXX = Specific Device Code A = Assembly Location Y = Year 3.790 WW = Work Week 2X 0.149 G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to 2.250 2X ǒ mm Ǔ SCALE 4:1 device data sheet for actual part marking. 0.089 inches Pb−Free indicator, “G” or microdot “ G”, may or may not be present. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON97675F
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SMC 2−LEAD PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com