Datasheet MAX4684, MAX4685 (Maxim) - 2
| Hersteller | Maxim |
| Beschreibung | 0.5Ω/0.8Ω Low-Voltage, Dual SPDT Analog Switches in UCSP |
| Seiten / Seite | 10 / 2 — Absolute Maximum Ratings. Note 1:. Note 2:. Package Information. PACKAGE … |
| Dateiformat / Größe | PDF / 2.0 Mb |
| Dokumentensprache | Englisch |
Absolute Maximum Ratings. Note 1:. Note 2:. Package Information. PACKAGE TYPE. PACKAGE CODE. DOCUMENT NO. 21-0104. 21-0137. 21-0061
Modelllinie für dieses Datenblatt
Textversion des Dokuments
MAX4684/MAX4685 0.5Ω/0.8Ω Low-Voltage, Dual SPDT Analog Switches in UCSP
Absolute Maximum Ratings
(All Voltages Referenced to GND) Continuous Power Dissipation (TA = +70°C) V+, IN_ ..-0.3V to +6V 10-Pin TDFN (derate 18.5mW/°C above +70°C) ..1482mW COM_, NO_, NC_ (Note1) ..-0.3V to (V+ + 0.3V) 12-Bump UCSP (derate 11.4mW/°C above +70°C) ..909mW Continuous Current NO_, NC_, COM_ ..±300mA 10-Pin μMAX (derate 5.6mW/°C above +70°C) ..444mW Peak Current NO_, NC_, COM_ Operating Temperature Ranges ... -40°C to +85°C (pulsed at 1ms, 50% duty cycle) ..±400mA Storage Temperature Range .. -65°C to +150°C Peak Current NO_, NC_, COM_ Lead Temperature (soldering, 10s) ...+300°C pulsed at 1ms, 10% duty cycle) ...±500mA Bump Temperature (soldering) (Note 2) Infared (15s) ..+220°C Vapor Phase (60s) ...+215°C
Note 1:
Signals on NO_, NC_, and COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
12 UCSP B12-4
21-0104
10 TDFN-EP T1033-1
21-0137
10 μMAX U10-2
21-0061
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Electrical Characteristics—+3V Supply
(V+ = +2.7V to +3.3V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at +3V and +25°C.) (Notes 3, 9, 10)
PARAMETER SYMBOL CONDITIONS TA MIN TYP MAX UNITS ANALOG SWITCH
Analog Signal Range VNO_, VNC_, VCOM_ E 0 V+ V +25°C 0.3 0.5 MAX4684 NC_ On-Resistance V+ = 2.7V; ICOM _ = 100mA; E 0.5 (Note 4) RON(NC) V Ω NC_ = 0 to V+ +25°C 0.45 0.8 MAX4685 E 0.8 NO_ On-Resistance V+ = 2.7V; ICOM_ = 100mA; +25°C 0.45 0.8 (Note 4) RON(NO) V Ω NO_ = 0 to V+ E 0.8 On-Resistance Match +25°C 0.06 Between Channels
∆
R V+ = 2.7V; I ON COM_ = 100mA; Ω (Notes 4, 5) VNO_ or V NC_ = 1.5V E 0.06 NC_ On-Resistance V+ = 2.7V; ICOM = 100mA; MAX4684 E 0.15 Flatness (Note 6) RFLAT (NC) V Ω NC_ = 0 to V+ MAX4685 E 0.35 NO_ On-Resistance V+ = 2.7V; ICOM = 100mA; Flatness (Note 6) RFLAT (NO) VNO_ = 0 to V+ E 0.35 Ω www.maximintegrated.com Maxim Integrated │ 2
Absolute Maximum Ratings
(All Voltages Referenced to GND) Continuous Power Dissipation (TA = +70°C) V+, IN_ ..-0.3V to +6V 10-Pin TDFN (derate 18.5mW/°C above +70°C) ..1482mW COM_, NO_, NC_ (Note1) ..-0.3V to (V+ + 0.3V) 12-Bump UCSP (derate 11.4mW/°C above +70°C) ..909mW Continuous Current NO_, NC_, COM_ ..±300mA 10-Pin μMAX (derate 5.6mW/°C above +70°C) ..444mW Peak Current NO_, NC_, COM_ Operating Temperature Ranges ... -40°C to +85°C (pulsed at 1ms, 50% duty cycle) ..±400mA Storage Temperature Range .. -65°C to +150°C Peak Current NO_, NC_, COM_ Lead Temperature (soldering, 10s) ...+300°C pulsed at 1ms, 10% duty cycle) ...±500mA Bump Temperature (soldering) (Note 2) Infared (15s) ..+220°C Vapor Phase (60s) ...+215°C
Note 1:
Signals on NO_, NC_, and COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
12 UCSP B12-4
21-0104
10 TDFN-EP T1033-1
21-0137
10 μMAX U10-2
21-0061
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Electrical Characteristics—+3V Supply
(V+ = +2.7V to +3.3V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at +3V and +25°C.) (Notes 3, 9, 10)
PARAMETER SYMBOL CONDITIONS TA MIN TYP MAX UNITS ANALOG SWITCH
Analog Signal Range VNO_, VNC_, VCOM_ E 0 V+ V +25°C 0.3 0.5 MAX4684 NC_ On-Resistance V+ = 2.7V; ICOM _ = 100mA; E 0.5 (Note 4) RON(NC) V Ω NC_ = 0 to V+ +25°C 0.45 0.8 MAX4685 E 0.8 NO_ On-Resistance V+ = 2.7V; ICOM_ = 100mA; +25°C 0.45 0.8 (Note 4) RON(NO) V Ω NO_ = 0 to V+ E 0.8 On-Resistance Match +25°C 0.06 Between Channels
∆
R V+ = 2.7V; I ON COM_ = 100mA; Ω (Notes 4, 5) VNO_ or V NC_ = 1.5V E 0.06 NC_ On-Resistance V+ = 2.7V; ICOM = 100mA; MAX4684 E 0.15 Flatness (Note 6) RFLAT (NC) V Ω NC_ = 0 to V+ MAX4685 E 0.35 NO_ On-Resistance V+ = 2.7V; ICOM = 100mA; Flatness (Note 6) RFLAT (NO) VNO_ = 0 to V+ E 0.35 Ω www.maximintegrated.com Maxim Integrated │ 2