Datasheet NC7S14 (ON Semiconductor) - 7
| Hersteller | ON Semiconductor |
| Beschreibung | TinyLogic HS Inverter with Schmitt Trigger Input |
| Seiten / Seite | 10 / 7 — PACKAGE DIMENSIONS. SC−74A. SCALE 2:1. 5X b. DETAIL A. MILLIMETERS. DIM. … |
| Revision | 3 |
| Dateiformat / Größe | PDF / 306 Kb |
| Dokumentensprache | Englisch |
PACKAGE DIMENSIONS. SC−74A. SCALE 2:1. 5X b. DETAIL A. MILLIMETERS. DIM. MIN. MAX. TOP VIEW. C SEATING. SIDE VIEW. END VIEW. PLANE. RECOMMENDED
Modelllinie für dieses Datenblatt
Textversion des Dokuments
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SC−74A
CASE 318BQ 5 ISSUE B 1 DATE 18 JAN 2018
SCALE 2:1 5X b
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME 0.20 C A B Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
M
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
5 4
THICKNESS. MINIMUM LEAD THICKNESS IS THE
E1 E
MINIMUM THICKNESS OF BASE MATERIAL.
1 2 3
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD 0.05
A1
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
L
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
B e
EXCEED 0.15 PER SIDE.
DETAIL A A D MILLIMETERS DIM MIN MAX TOP VIEW A
0.90 1.10
A1
0.01 0.10
A DETAIL A b
0.25 0.50
c
0.10 0.26
D
2.85 3.15
E
2.50 3.00
E1
1.35 1.65
c e
0.95 BSC
C SEATING SIDE VIEW END VIEW PLANE L
0.20 0.60
M
0 10 _ _
RECOMMENDED GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
0.95 PITCH XXX MG G XXX = Specific Device Code 2.40 M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. 5X Pb−Free indicator, “G” or microdot “ 1.00 5X G”, 0.70 may or may not be present. Some products may not follow the Generic Marking. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON66279G
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red. © Semiconductor Components Industries, LLC, 2002
http://onsemi.com
Case Outline Number:
October, 2002 − Rev. 0 DESCRIPTION: SC−74A 1 PAGE XXX 1 OF 2
PACKAGE DIMENSIONS SC−74A
CASE 318BQ 5 ISSUE B 1 DATE 18 JAN 2018
SCALE 2:1 5X b
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME 0.20 C A B Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
M
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
5 4
THICKNESS. MINIMUM LEAD THICKNESS IS THE
E1 E
MINIMUM THICKNESS OF BASE MATERIAL.
1 2 3
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD 0.05
A1
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
L
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
B e
EXCEED 0.15 PER SIDE.
DETAIL A A D MILLIMETERS DIM MIN MAX TOP VIEW A
0.90 1.10
A1
0.01 0.10
A DETAIL A b
0.25 0.50
c
0.10 0.26
D
2.85 3.15
E
2.50 3.00
E1
1.35 1.65
c e
0.95 BSC
C SEATING SIDE VIEW END VIEW PLANE L
0.20 0.60
M
0 10 _ _
RECOMMENDED GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
0.95 PITCH XXX MG G XXX = Specific Device Code 2.40 M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. 5X Pb−Free indicator, “G” or microdot “ 1.00 5X G”, 0.70 may or may not be present. Some products may not follow the Generic Marking. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON66279G
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red. © Semiconductor Components Industries, LLC, 2002
http://onsemi.com
Case Outline Number:
October, 2002 − Rev. 0 DESCRIPTION: SC−74A 1 PAGE XXX 1 OF 2