Datasheet ADSP-21065L-EP (Analog Devices) - 9

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Enhanced Product ADSP-21065L-EP PACKAGE MARKING INFORMATION ENVIRONMENTAL CONDITIONS
Figure 2 and Table 4 provide information on detail contained The ADSP-21065L-EP processor is rated for performance under within the package marking for the ADSP-21065L-EP processor TCASE environmental conditions specified in the Operating Con- (actual marking format may vary). For a complete listing of ditions on Page 8. product availability, see Ordering Guide on Page 13.
Thermal Characteristics
The ADSP-21060L-EP is offered in a 208-lead MQFP package. The ADSP-21065L-EP is specified for a case temperature (TCASE). To ensure that the TCASE is not exceeded, an airflow source may be used. a TCASE = TAMB + (PD  CA)
ADSP21065L
TCASE = Case temperature (measured on top surface of package)
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PD = Power dissipation in W (this value depends upon the spe-
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cific application) JC = 7.1°C/W S
Table 5. Thermal Characteristics (208-Lead MQFP) Parameter Airflow (Linear Ft./Min.) Typical Unit
Figure 2. Typical Package Brand CA 0 24 °C/W
Table 4. Package Brand Information
CA 100 20 °C/W 
Brand Key Field Description
CA 200 19 °C/W  t Temperature Range CA 400 17 °C/W  pp Package Type CA 600 13 °C/W ccc See Ordering Guide EP Enhanced Processing vvvvvv.x Assembly Lot Code n.n Silicon Revision yyww Date Code Rev. B | Page 9 of 14 | September 2017 Document Outline Summary Enhanced Product (EP) Features Features Table of Contents Revision History General Description Pin Function Descriptions Specifications Operating Conditions Absolute Maximum Ratings ESD Caution Package Marking Information Environmental Conditions Thermal Characteristics 208-LEAD MQFP Pin Configuration Outline Dimensions Ordering Guide