Datasheet IR53HD420, IR53H420 (Infineon) - 2
| Hersteller | Infineon |
| Beschreibung | Self-Oscillating Half Bridge |
| Seiten / Seite | 8 / 2 — IR53H(D)420. Absolute Maximum Ratings. Symbol. Definition. Minimum. … |
| Dateiformat / Größe | PDF / 72 Kb |
| Dokumentensprache | Englisch |
IR53H(D)420. Absolute Maximum Ratings. Symbol. Definition. Minimum. Maximum. Units. NOTE 1:
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IR53H(D)420 Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All volt- age parameters are absolute voltages referenced to COM, unless stated otherwise. All currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Minimum Maximum Units
VIN High voltage supply - 0.3 500 VB High side floating supply Vo - 0.3 Vo + 25 V V O Half-bridge output -0.3 VIN + 0.3 VRT RT voltage - 0.3 Vcc + 0.3 VCT CT voltage - 0.3 Vcc + 0.3 Icc Supply current (note 1) — 25 mA IRT RT output current - 5 5 dV/dt Peak diode recovery — 3.50 V/ns PD Package power dissipation @ TA ≤ +25°C — 2 W -P2 — 3 RthJA Thermal resistance, junction to ambient — 60 -P2 — 40 oC/W RthJC Thermal resistance, junction to case -P2 — 20 (heatsink) TJ Junction temperature -55 150 TS Storage temperature -55 150 °C TL Lead temperature (soldering, 10 seconds) — 300
NOTE 1:
This IC contains a zener clamp structure between VCC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics Section 2 www.irf.com
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All volt- age parameters are absolute voltages referenced to COM, unless stated otherwise. All currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Minimum Maximum Units
VIN High voltage supply - 0.3 500 VB High side floating supply Vo - 0.3 Vo + 25 V V O Half-bridge output -0.3 VIN + 0.3 VRT RT voltage - 0.3 Vcc + 0.3 VCT CT voltage - 0.3 Vcc + 0.3 Icc Supply current (note 1) — 25 mA IRT RT output current - 5 5 dV/dt Peak diode recovery — 3.50 V/ns PD Package power dissipation @ TA ≤ +25°C — 2 W -P2 — 3 RthJA Thermal resistance, junction to ambient — 60 -P2 — 40 oC/W RthJC Thermal resistance, junction to case -P2 — 20 (heatsink) TJ Junction temperature -55 150 TS Storage temperature -55 150 °C TL Lead temperature (soldering, 10 seconds) — 300
NOTE 1:
This IC contains a zener clamp structure between VCC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics Section 2 www.irf.com